Wire flash
FinanceNvidia and Amkor Sign $1.5 Billion Chip Packaging Deal
Editorial responsibility
- No named human review is recorded for this page.
- Source reporting is collected, normalized, translated or condensed automatically when needed.
- Automatically published source-backed update
On July 23, 2026, Amkor Technology announced a multi-year agreement with Nvidia valued at $1.5 billion to expand advanced semiconductor packaging and testing capacity in the United States, particularly in Arizona. Under the deal, Nvidia will make a prepayment to support Amkor's U.S. operations. The companies will jointly develop packaging and testing technologies for Nvidia's AI and accelerated-computing platforms, focusing on combining different chip types in a single package. Amkor already supplies advanced packaging for Nvidia's data center processors. The expanded partnership aims to meet growing AI infrastructure demand. Additionally, Amkor recently entered a 10-year partnership with TSMC and is also working with Advanced Micro Devices on chip packaging. Following the announcement, Amkor's shares rose 17% in extended trading.
Source report
Reuters Thu, July 23, 2026 at 2:44 PM PDT | 1 min read
Stock Tickers: NVDA -0.92% | AMKR -0.57% | TSM -2.93%
July 23 (Reuters) – Amkor Technology announced on Thursday that it has entered into a multi-year agreement with Nvidia valued at $1.5 billion to expand advanced semiconductor packaging and test capacity in the United States, as the chip industry accelerates efforts to build out AI infrastructure.
Shares of the semiconductor packaging company surged 17% in extended trading.
Key Details of the Partnership
- Prepayment for Expansion: Under the agreement, Nvidia will make a prepayment to support the expansion of Amkor's U.S. advanced packaging operations, including capacity in Arizona.
- Joint Technology Development: The companies will jointly develop packaging and testing technologies for Nvidia's AI and accelerated-computing platforms, with a focus on combining different types of chips in a single package.
- Existing and Expanded Collaboration: Amkor already supplies advanced packaging for Nvidia's product portfolio, including data center processors. The expanded deal aims to bring new packaging technologies to market as demand for AI infrastructure grows.
- TSMC Partnership: In June, Amkor entered a 10-year partnership with TSMC, the world's largest contract chipmaker, to enhance semiconductor packaging capabilities in the United States.
- AMD Collaboration: Amkor is also working with Advanced Micro Devices to package the semiconductor company's chips.
Reporting by Juby Babu in Mexico City; Editing by Pooja Desai
Source
Yahoo FinanceWestern
Part of this Story
Nvidia and Amkor Sign $1.5 Billion Chip Packaging Deal