Nvidia and Amkor Sign $1.5 Billion Chip Packaging Deal
On July 23, 2026, Amkor Technology announced a multi-year agreement with Nvidia valued at $1.5 billion to expand advanced semiconductor packaging and testing capacity in the United States, particularly in Arizona. Under the deal, Nvidia will make a prepayment to support Amkor's U.S. operations. The companies will jointly develop packaging and testing technologies for Nvidia's AI and accelerated-computing platforms, focusing on combining different chip types in a single package. Amkor already supplies advanced packaging for Nvidia's data center processors. The expanded partnership aims to meet growing AI infrastructure demand. Additionally, Amkor recently entered a 10-year partnership with TSMC and is also working with Advanced Micro Devices on chip packaging. Following the announcement, Amkor's shares rose 17% in extended trading.
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