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Longxin Technology: 5th-gen DRAM platform enters mass production, approaching tier-1 global level
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This daily market digest from Jin10, dated September 21, 2026, covers key developments in the global memory and semiconductor industry. Longxin Technology announced the mass production of its fifth-generation (G5) technology platform, bringing its general-purpose DRAM process close to international tier-1 levels. Sources indicate Longxin is preparing to enter the flash memory market, directly competing with Samsung, SK Hynix, and Micron. Acer noted that storage shortages are partially easing, but PC prices may not reverse until the second half of 2027. UBS forecasts global AI capital expenditure will reach $1.4 trillion by 2027, with 90% of the increase driven by memory price hikes. TrendForce reported a 0.75% day-on-day increase in the spot price of DDR5 16Gb (2Gx8) 4800/5600 modules. SK Hynix subsidiary Solidigm plans to build a NAND production base in the eastern United States. TrendForce also predicts CoWoS-L will remain the mainstream AI chip packaging solution through 2028. Mature-node foundries UMC and Powerchip are planning price increases amid demand surges. South Korea's exports for the first 20 days of September hit a record high, with chip exports surging nearly 260% year-on-year.
Source report
ChangXin Memory Technologies (CXMT) Reaches New Milestones
- CXMT announces mass production of its fifth-generation technology platform.
- The G5 mass production brings general-purpose DRAM process technology closer to global leading standards.
- According to sources, CXMT is preparing to enter the NAND flash memory market, positioning itself to compete directly with Samsung, SK Hynix, and Micron Technology.
Market Outlook & Pricing Trends
- Acer reports that storage shortages have been partially alleviated, but PC prices may reverse by the second half of 2027.
- UBS forecasts global AI-related capital expenditure will reach $1.4 trillion by 2027, with 90% of the increase driven by memory price hikes.
- TrendForce data shows the spot average price of DDR5 16Gb (2Gx8) 4800/5600 increased by 0.75% compared to the previous day.
Manufacturing & Packaging Developments
- SK Hynix subsidiary Solidigm plans to build a NAND production facility in the eastern United States.
- TrendForce (集邦咨询) predicts that CoWoS-L will remain the mainstream packaging solution for AI chips through 2028.
- Mature process node demand surges, prompting foundries such as UMC and Powerchip to consider price increases.
South Korea Export Highlights
- South Korea's exports for the first 20 days of this month hit a record high, with chip exports surging nearly 260% year-on-year.
Source
金十数据Neutral / independent
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Changxin Technology begins mass production of fifth-generation DRAM; shares surge 6%