SK Hynix Breaks Ground on $4 Billion AI Memory Packaging Plant in Indiana
SK Hynix held a groundbreaking ceremony on August 27, 2026, for its first U.S. advanced memory packaging facility in West Lafayette, Indiana. The $4 billion plant will produce high-bandwidth memory (HBM) chips for AI applications, with volume production of next-gen HBM4E expected by Q3 2029. Supported by $458 million in CHIPS Act grants and loans, the facility aims to reduce reliance on foreign supply chains. CEO Kwak Noh-Jung warned memory shortages will persist through 2030, as demand from AI customers like Nvidia surges.