TSMC commits additional $100 billion to Arizona for 2nm fabs and advanced packaging

Published Jul 16, 12:10 PM UTC

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TSMC CEO C.C. Wei announced a $100 billion investment to build at least four more 2nm-class chip fabs and advanced packaging facilities in Arizona, bringing total announced U.S. investment to $265 billion. The expansion, contingent on market demand, would bring TSMC's planned U.S. footprint to 10 fabs and two packaging plants. The announcement coincided with record quarterly earnings: net income of $22.35 billion (up 77.4% YoY) and revenue of $1.27 trillion (up 36%). TSMC raised its 2026 capex forecast to $60-64 billion, with 70-80% for advanced processes. The packaging component is critical as CoWoS capacity remains the binding constraint on AI accelerator production. TSMC also plans 13 leading-edge and advanced packaging fabs in Taiwan, addressing concerns about shifting investment away from home. Execution faces labor, water, and visa challenges in Arizona.

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Original headline: TSMC commits another $100 billion to Arizona for at least four more 2nm fabs — 2026 capex could hit $64 billion following another record quarterly earnings

Original language: EN

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TSMC Announces $100 Billion Expansion for New Arizona Chip Fabs

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