TSMC announces additional $100B investment in Arizona for four more 2nm and below fabs

Published Jul 16, 12:10 PM UTC

TSMC CEO C.C. Wei announced an additional $100 billion investment in Arizona to build at least four more 2nm and below chipmaking fabs, plus advanced packaging facilities, bringing total announced US investment to $265 billion. The expansion, contingent on market demand, would bring TSMC's planned US footprint to 10 fabs and two packaging plants. The announcement coincided with record quarterly earnings: net income of $22.35 billion (up 77.4% YoY) and revenue of $1.27 trillion (up 36%). TSMC raised its 2026 capex forecast to $60-64 billion, with 70-80% for advanced processes. The packaging component is critical as CoWoS capacity remains the binding constraint on AI accelerator production. TSMC also plans 13 leading-edge and packaging fabs in Taiwan, addressing concerns the US buildout comes at Taiwan's expense. Execution faces labor, water, and visa constraints in Arizona.