Biwin Storage Board Approves 4.5 Billion Yuan Phase III Investment Project
Biwin Storage announced on September 22 that it and its subsidiary Guangdong Xincheng Hanqi will invest approximately 4.5 billion yuan (4 billion yuan in fixed assets) in Phase III of a wafer-level advanced packaging and testing project in Dongguan's Songshan Lake High-Tech Zone. The project expands on existing land without new acquisition, targeting completion by December 31, 2029. Phases I and II, totaling 3.09 billion yuan, are in customer sampling and trial production, not yet generating mass production revenue. The company aims for monthly capacity of 5,000 wafers by end-2026 and 10,000 by end-2027.
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Cross-source coverage
Common ground
- All sides agree that Western export controls are a major factor pushing Biwin to build its own advanced packaging capacity.
- There is agreement that Biwin's Phase II has not yet generated mass production revenue, creating financial risk.
- All participants recognize that Biwin faces real competition from established Chinese firms like JCET, Tongfu, and Hua Tian.
- There is consensus that the US is likely to tighten restrictions on packaging equipment, adding urgency to Biwin's timeline.
Points of contention
- The Neutral Agent argues Biwin's expansion is a risky gamble without proven customer demand, while the Eastern and Regional Agents see it as a necessary strategic move under geopolitical pressure.
- The Eastern Agent believes China's industrial policy can support multiple players and that capital isn't wasted even if Biwin fails, but the Neutral Agent insists it's an inefficient use of scarce resources.
- The Regional Agent frames the investment as a fight against colonial control of technology, while the Neutral Agent says this rhetoric ignores basic business realities like yield rates and debt.
Blind spots
- All sides overlook the specific financial health and debt obligations of Biwin's creditors and local government backers, focusing instead on broad strategy.
- The debate lacks concrete data on how many wafers Biwin's potential customers (like Horizon Robotics) have actually committed to purchase.
- No one addresses the possibility that Biwin's technology could become obsolete if global packaging standards shift before its fabs are fully operational.
WorldAttention’s read
Biwin Storage's 4.5 billion yuan Phase III investment is a high-stakes bet driven by both geopolitical necessity and business risk. While Western export controls create a real urgency to build domestic capacity now, the company has yet to prove it can profitably run its earlier phases or lock in mass-production customers. Domestic rivals like JCET already have qualified products shipping, so Biwin isn't just fighting the West—it's competing with other Chinese firms. The move makes strategic sense as a hedge against future equipment bans, but it remains a gamble on unproven technology and unsecured demand. Ultimately, this is a wartime industrial decision, not a normal corporate expansion, and its success will depend on whether Biwin can fill its fabs before the cash runs out.
Reporting timeline
Biwin Storage Plans 4.5 Billion Yuan Investment in Wafer-Level Advanced Packaging Phase III
Biwin Storage announced on September 22 that it and its subsidiary Guangdong Xinchenghanqi Semiconductor Technology Co., Ltd. plan to sign a project cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee to build Phase III of a wafer-level advanced packaging and testing manufacturing project, with a total estimated investment of approximately 4.5 billion yuan, including 4 billion yuan in fixed assets. The Phase III project, located in Dongguan Ecological Park, will expand wafer-level advanced packaging capacity on existing industrial land without requiring new land acquisition. The project is scheduled to complete fixed asset investment by December 31, 2029, with funding from Guangdong Xinchenghanqi's own and self-raised funds, including third-party capital increases and bank loans, not involving raised funds. Biwin Storage's Phase I and II of the project, with a planned investment of 3.09 billion yuan, have been completed, achieving a 2.5D monthly capacity of approximately 3,000 wafers. Phase I has completed factory construction and equipment installation, while Phase II equipment is being installed and is in customer sampling, process verification, and small-batch trial production stages, not yet generating mass production revenue. Guangdong Xinchenghanqi has built capabilities in 2.5D, RDL, Fan-in, and Fan-out advanced packaging technologies. Biwin Storage stated that Phase III will further expand wafer-level advanced packaging capabilities and promote industrialization and mass production of multi-chip system-in-package and memory-compute integrated packaging technologies.
Biwin Storage Plans $4.5 Billion Investment in Wafer-Level Advanced Packaging Project Phase 3
Biwin Storage Technology Co., Ltd. (stock code 688525) announced on September 22 that it and its subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd. will sign a tripartite agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee to build Phase 3 of a wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan, with 4 billion yuan allocated to fixed assets, funded by the company's own and self-raised capital. This follows the completion of Phases 1 and 2, which involved 3.09 billion yuan in investment and achieved a monthly capacity of about 3,000 wafers. Phase 1 has completed factory construction and equipment installation, while Phase 2 is in customer sampling and trial production stages. The company expects monthly capacity to reach 5,000 wafers by end of 2026 and 10,000 wafers by end of 2027. A company official stated the project aims to enhance independent innovation and break through key technologies in wafer-level advanced packaging. Analyst Bai Wenxi noted that advanced packaging is crucial for high-bandwidth memory and AI terminals, offering miniaturization and low-power advantages. Biwin Storage reported strong first-half 2025 results with revenue of 15.575 billion yuan, up 298.10% year-on-year, and net profit of 7.166 billion yuan, turning profitable.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment in Wafer-Level Advanced Packaging Phase III
On September 22, Biwin Storage (stock code 688525) announced that it, along with its controlling subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd., plans to sign a Phase III cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee for a wafer-level advanced packaging and testing manufacturing project. The total estimated investment for Phase III is approximately 4.5 billion yuan, including 4 billion yuan in fixed assets such as buildings, structures, and equipment. The project focuses on expanding wafer-level advanced packaging and testing capacity, including equipment investment and factory renovation. As of the announcement date, Phase I has completed factory construction and equipment installation and commissioning. Phase II equipment is being installed and commissioned, currently in customer sampling, process verification, and small-batch trial production stages, with no formal mass production revenue yet. Biwin Storage stated that after the project is operational, it will strengthen the Greater Bay Area's competitiveness in the global semiconductor industry and inject new momentum into China's integrated circuit industry. The company's stock closed at 217.22 yuan per share on September 22, with a total market capitalization of 103.6 billion yuan.
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Biwin Storage Plans $6.3 Billion Investment in Crystal-Level Advanced Packaging Phase 3
Biwin Storage announced on September 22 that it and its subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd. plan to sign a project cooperation agreement with the Dongguan Songshan Lake High-tech Industrial Development Zone Management Committee to build Phase 3 of a crystal-level advanced packaging and testing manufacturing project. The total estimated investment is approximately 4.5 billion yuan ($630 million), with 4 billion yuan allocated for fixed assets. The project, located in Dongguan Ecological Park, will expand existing facilities without requiring new land, focusing on crystal-level advanced packaging capacity expansion including equipment and factory renovations. Fixed asset investment is targeted for completion by December 31, 2029, funded by the subsidiary's own and raised capital, excluding raised funds. Phases 1 and 2, with a planned investment of 3.09 billion yuan, are completed, achieving a monthly 2.5D capacity of about 3,000 wafers. Phase 1 has finished construction and equipment installation, while Phase 2 equipment is being installed and is in customer sampling, process verification, and small-batch trial production, not yet generating mass production revenue. The subsidiary has built capabilities in 2.5D, RDL, Fan-in, and Fan-out packaging technologies. Biwin stated Phase 3 will further expand crystal-level advanced packaging capabilities and promote multi-chip system-in-package and memory-compute integration packaging technology industrialization and mass production.
Read sourceBiwin Storage Invests Additional 4.5 Billion Yuan to Expand Advanced Packaging Capacity
Biwin Storage, a Chinese memory module manufacturer, announced on September 21 that it will invest approximately 4.5 billion yuan (4.0 billion in fixed assets) in Phase III of its wafer-level advanced packaging and testing project in Dongguan's Songshan Lake High-Tech Zone. Unlike previous phases, Phase III will not require new industrial land, as it expands within the existing site. The company's board has approved the investment, which will be funded through internal and self-raised capital. Biwin's Phase I and II projects, totaling 3.09 billion yuan, are already in equipment installation, process verification, and customer sampling stages. The company expects its wafer-level advanced packaging capacity to reach 5,000 wafers per month by end-2026 and 10,000 by end-2027, with revenue contribution starting in late 2026. Biwin is also developing its own eMMC and UFS controller chips, collaborating with foundries on NAND Flash media design, and expanding enterprise storage products for data centers and AI servers. The company reports advanced packaging yield above 95% and expects gross margins of 30-40% for this business.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment for Advanced Packaging Project Phase Three
On September 22, Biwin Storage (688525.SH) announced that it, along with its controlling subsidiary Guangdong Xincheng Hanqi, plans to sign a cooperation agreement with the Dongguan Songshan Lake High-tech Zone Management Committee to invest in the third phase of a wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan (about 45 billion RMB), including 4 billion yuan in fixed assets. The project will not involve new land acquisition, as all construction will take place within the existing industrial land of the original project. The company stated that this investment represents an expansion and capacity increase based on the original project, with funding sourced from its own funds and self-raised capital, and does not involve any raised funds.
Read sourceBiwin Storage Invests 4.5 Billion Yuan to Expand Advanced Packaging Capacity
Biwin Storage, a Chinese memory module maker, announced on September 21 that it will invest approximately 4.5 billion yuan (4.0 billion in fixed assets) in a third-phase wafer-level advanced packaging and testing project at its existing site in Dongguan Songshan Lake. The project, approved by the board, will be funded by internal and self-raised capital. This follows earlier phases totaling 3.09 billion yuan, which are in equipment installation and customer sampling stages. Biwin expects the overall advanced packaging project to reach 5,000 wafers per month by end-2026 and 10,000 by end-2027, with revenue contribution starting in late 2026. The company's subsidiary, Guangdong Xincheng Hanqi, has developed capabilities in 2.5D, RDL, Fan-in, and Fan-out packaging. Biwin is also expanding into self-developed eMMC and UFS controller chips, NAND Flash media design (SLC/MLC at 24nm/19nm nodes), and enterprise storage for data centers and AI servers. The company aims to transform from a traditional module maker into an integrated storage firm covering media, controller, packaging, and finished products.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment in Advanced Wafer-Level Packaging
On September 22, Chinese memory leader Biwin Storage announced a planned self-funded investment of 4.5 billion yuan (4.0 billion yuan in fixed assets) in Phase III of its wafer-level advanced packaging and testing manufacturing project, to be completed by December 31, 2029. The company and its subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd. intend to sign a cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee. Phases I and II of the project, with a planned investment of 3.09 billion yuan, are currently in customer sampling, process verification, and small-batch trial production stages, with equipment being delivered and installed. Phase III is an expansion on existing land. The company targets a monthly capacity of 5,000 wafers by end-2026 and 10,000 wafers by end-2027, with revenue contribution expected from end-2026. In the first half of 2026, Biwin reported revenue of 15.575 billion yuan (up nearly 3x year-on-year) and net profit of 7.166 billion yuan. The project aims to advance key technologies in multi-chip system-in-package and memory-compute integration. The article notes this move benefits the tech chip design sector, particularly companies involved in 2.5D/3D packaging, RDL, and fan-out technologies.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment in Wafer-Level Advanced Packaging
On September 22, Chinese storage leader Biwin Storage announced a self-funded 4.5 billion yuan investment in Phase III of its wafer-level advanced packaging and testing manufacturing project, with fixed asset investment of 4 billion yuan to be completed by December 31, 2029. The project, located in Dongguan Songshan Lake, will be carried out by subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd. Phases I and II, totaling 3.09 billion yuan, are in customer sampling and trial production stages with a planned capacity of 3,000 wafers per month (2.5D capacity). The company aims to reach 5,000 wafers per month by end-2026 and 10,000 wafers per month by end-2027, with revenue contribution expected from late 2026. In the first half of 2026, Biwin reported revenue of 15.575 billion yuan (up nearly 300% year-on-year) and net profit of 7.166 billion yuan, including 6.244 billion yuan from smart mobile and AI edge storage. The investment targets key technologies such as 2.5D/3D packaging, RDL, and fan-out, benefiting chip design firms and AI chip supply chains. The article also promotes a related ETF tracking the科创芯片设计 index.
Read sourceBiwin Storage Plans $45B Investment Amid Stock Plunge and AI Memory Boom
Biwin Storage (佰维存储) announced a 4.5 billion yuan investment in a third-phase wafer-level advanced packaging and testing project in Dongguan's Songshan Lake, despite its first two phases not yet in mass production. The company's stock has fallen over 50% from its June peak of 516.58 yuan, even as it reported strong 2026 first-half results: revenue surged 298% to 155.75 billion yuan, with net profit turning positive at 71.66 billion yuan. AI-related end-side storage revenue grew 433%. However, market concerns are mounting over a slowdown in the memory 'super cycle.' TrendForce data shows DRAM contract price growth slowing to 13-18% in Q3 2026 from 58-63% in Q2, and NAND Flash growth also decelerating. Analysts warn the industry is shifting from broad-based growth to a structural market, with consumer-grade storage likely weakening first. Biwin's heavy investment comes amid negative operating cash flow of -62.61 billion yuan and high inventory of 181.68 billion yuan, raising questions about financial pressure. The company aims to upgrade from a storage solution provider to a full-stack 'storage + advanced packaging' technology service provider.
Read sourceBiwin Storage and Subsidiary Invest 4.5 Billion Yuan in Wafer-Level Advanced Packaging Project
On September 22, Shenzhen Biwin Storage Technology Co., Ltd. announced that it and its subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd. plan to sign a Phase III cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee to build a wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan, with 4 billion yuan in fixed assets. The project will be funded by the company's own and self-raised funds, not involving raised capital. This follows the completion of Phase I and II investments totaling 3.09 billion yuan, which have achieved a monthly capacity of about 3,000 wafers. Biwin expects the project's monthly capacity to reach 5,000 wafers by the end of 2026 and 10,000 wafers by the end of 2027. A company official stated that the project will enhance independent innovation and promote the industrialization of multi-chip system-in-package and memory-computing integrated packaging technology. An analyst noted that advanced packaging is crucial for high-bandwidth memory and AI terminals as semiconductor processes approach physical limits. Biwin Storage reported strong first-half 2025 results, with revenue of 15.575 billion yuan, up 298.10% year-on-year, and a net profit of 7.166 billion yuan, turning from a loss to a profit.
Read sourceBiwin Storage Invests 4.5 Billion Yuan in Third Phase of Wafer-Level Advanced Packaging Project
Biwin Storage announced on September 22 that it will invest approximately 4.5 billion yuan (4 billion yuan in fixed assets) in the third phase of its wafer-level advanced packaging and testing manufacturing project in Dongguan Songshan Lake, building on existing land. The first two phases, totaling 3.09 billion yuan, have been completed with a monthly capacity of about 3,000 wafers, currently in customer sampling and trial production. The company reported strong financial performance for the first half of 2026, with revenue of 15.575 billion yuan (up 298.10% year-on-year) and net profit of 7.166 billion yuan, reversing a prior-year loss. AI end-side storage products contributed 2.86 billion yuan in revenue, up 433.58%, as the core growth driver. Biwin aims to reach 5,000 wafers per month by end-2026 and 10,000 by end-2027. Chairman Sun Chengsi stated the strategy is to upgrade from a storage solution provider to a full-stack 'storage + advanced packaging' technology service provider for the AI era. The investment follows broader industry trends, with JCET raising its 2026 capex to ~10 billion yuan and Tongfu Microelectronics launching a 4.4 billion yuan private placement for advanced packaging capacity.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment for Wafer-Level Advanced Packaging Project Phase III
Biwin Storage (688525) announced on September 22 evening that it and its subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd. plan to sign a cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee for Phase III of the Wafer-Level Advanced Packaging and Testing Manufacturing Project. The total estimated investment is approximately 4.5 billion yuan, including 4 billion yuan in fixed assets such as buildings, structures, and equipment. The project will be located in Dongguan's Ecological Park and involves expanding wafer-level advanced packaging capacity within the existing industrial land, with no new land acquisition. The investment is expected to be completed by December 31, 2029, funded by the subsidiary's own funds and self-raised capital, including third-party capital increases and bank loans, excluding raised funds. Phases I and II, with a planned investment of 3.09 billion yuan, have been completed, with equipment being delivered and currently in customer sampling, process verification, and trial production stages. The company stated the investment aims to enhance competitiveness, strengthen the Greater Bay Area's semiconductor industry position, and promote supply chain security.
Read sourceBiwin Storage plans 4.5 billion yuan investment in advanced chip packaging project phase three
On September 22, Biwin Storage (688525) announced plans to invest 4.5 billion yuan of self-raised funds in Phase III of its wafer-level advanced packaging and testing manufacturing project, with fixed asset investment of 4 billion yuan to be completed by December 31, 2029. The project, located in Dongguan Songshan Lake, will be built on existing industrial land without new land acquisition. The company's subsidiary Guangdong Xincheng Hanqi Semiconductor Technology has developed advanced packaging technologies including 2.5D, RDL, Fan-in, and Fan-out. Phases I and II, with a combined planned investment of 3.09 billion yuan, are currently in customer sampling, process verification, and small-batch trial production stages, not yet generating mass production revenue. Biwin Storage warned of risks including market changes, macroeconomic conditions, and potential failure to meet completion timelines or expected returns. The company also operates a memory and SiP packaging base in Huizhou. Management targets monthly capacity of 5,000 wafers by end-2026 and 10,000 wafers by end-2027, with revenue contribution expected from end-2026. In the first half of 2026, the company reported revenue of 15.575 billion yuan, nearly triple year-on-year, with net profit of 7.166 billion yuan, including 6.244 billion yuan from smart mobile and AI edge storage.
Read sourceBiwin Storage Plans ~4.5 Billion Yuan Investment in Advanced Chip Packaging Project Phase III
On the evening of September 22, Biwin Storage (stock code 688525) announced that the company and its majority-owned subsidiary Guangdong Xincheng Hanqi plan to sign a cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee to invest in the third phase of a wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan, including 4 billion yuan in fixed assets, with no new land acquisition required. The fixed asset investment is expected to be completed by December 31, 2029, funded by the company's own and self-raised capital. The company stated that the matter has been approved by its board of directors and does not require shareholder approval. The first and second phases of the project, with a planned investment of 3.09 billion yuan, have been completed and are currently in the stages of customer sampling, process verification, and small-batch trial production, and have not yet generated mass production revenue. The company noted that as semiconductor processes approach physical limits, advanced packaging is an important path 'beyond Moore's Law,' offering advantages such as miniaturization, thinness, low power consumption, and functional integration, and can be widely used in emerging fields like smart terminals and high-performance computing. Guangdong Xincheng Hanqi aims to enhance its independent innovation capabilities through this project, drive breakthroughs in key technologies for wafer-level advanced packaging and testing, and promote the industrialization and mass production of multi-chip system-in-package and memory-computing integration packaging technologies.
Read sourceBiwin Storage Signs 4.5 Billion Yuan Chip Packaging Agreement with Dongguan Songshan Lake
Biwin Storage (688525) announced on September 22 that it, along with its controlling subsidiary Guangdong Xincheng Hanqi, will sign a Phase III cooperation agreement for a wafer-level advanced packaging and testing manufacturing project with the Dongguan Songshan Lake High-tech Industrial Development Zone Management Committee. The total investment for the project is approximately 4.5 billion yuan, including 4 billion yuan in fixed assets. The company's board of directors approved the investment at its 23rd meeting of the 4th session on September 21, 2026. The investment falls within the board's approval authority and does not require shareholder approval. The announcement was published via Securities Daily and sourced from Tonghuashun Finance.
Read sourceChina's Memory Chip Leader Biwin Storage Plans $6.3B Advanced Packaging Project
On September 22, Biwin Storage (688525.SH), a leading A-share memory chip company, announced that it and its subsidiary Guangdong Xincheng Hanqi plan to sign a Phase III cooperation agreement for a wafer-level advanced packaging and testing manufacturing project with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee. The total estimated investment for Phase III is approximately 4.5 billion yuan (about $630 million), including 4 billion yuan in fixed assets. The company has already completed the planned 3.09 billion yuan investment for Phases I and II, which are currently in customer sampling, process verification, and small-batch trial production stages, with no mass production revenue yet. Guangdong Xincheng Hanqi has built capabilities in 2.5D, RDL, Fan-in, and Fan-out advanced packaging technologies. The Phase III project is an expansion on the existing site without requiring new land. As of the close on September 22, Biwin Storage's stock price was 217.22 yuan, giving it a market cap of 103.6 billion yuan, with a year-to-date gain of 89.73%.
Read sourceChina's Memory Chip Leader Biwin Storage Plans $6.3B Advanced Packaging Project
On September 22, Biwin Storage (688525.SH), a leading A-share memory chip company, announced that it and its subsidiary Guangdong Xincheng Hanqi plan to sign a Phase III cooperation agreement with the Dongguan Songshan Lake High-tech Industrial Development Zone Management Committee for a wafer-level advanced packaging and testing manufacturing project. The total investment for Phase III is approximately 4.5 billion yuan (about $630 million), including 4 billion yuan in fixed assets. Phases I and II, with a planned investment of 3.09 billion yuan, have been completed, with equipment being delivered and a monthly capacity of about 3,000 wafers. Phase I has finished factory construction and equipment installation, while Phase II is in customer sampling, process verification, and small-batch trial production stages, not yet generating mass production revenue. The subsidiary has built capabilities in 2.5D, RDL, Fan-in, and Fan-out advanced packaging technologies. Phase III is an expansion on the existing industrial land without requiring new land. As of September 22, Biwin Storage's stock closed at 217.22 yuan, with a market cap of 103.6 billion yuan and a year-to-date gain of 89.73%.
Read sourceBiwin Storage to Invest 4.5 Billion Yuan in Third Phase of Wafer-Level Advanced Packaging Project
On September 21, memory chip company Biwin Storage announced a planned self-funded investment of 4.5 billion yuan (approximately $620 million) in the third phase of its wafer-level advanced packaging and testing manufacturing project in Dongguan, with fixed asset investment to be completed by December 31, 2029. The project, to be carried out by subsidiary Guangdong Xincheng Hanqi Semiconductor Technology, follows the completion of phases one and two, which cost 3.09 billion yuan and are currently in customer sampling and trial production stages. The third phase will expand capacity on existing land without new land acquisition. Biwin cited advanced packaging as a key path beyond Moore's Law for improving chip performance, targeting applications in smart terminals and high-performance computing. The company plans to reach a monthly capacity of 5,000 wafers by end-2026 and 10,000 wafers by end-2027, with revenue contribution expected from late 2026. Biwin also warned of risks including market changes and project execution uncertainties. In the first half of 2026, the company reported revenue of 15.575 billion yuan, nearly tripling year-on-year, with net profit of 7.166 billion yuan.
Read sourceBiwin Storage to Invest 4.5 Billion Yuan in Third Phase of Wafer-Level Advanced Packaging Project
On September 21, memory chip maker Biwin Storage (688525) announced a planned self-funded investment of 4.5 billion yuan ($630 million) in the third phase of its wafer-level advanced packaging and testing manufacturing project in Dongguan, with fixed asset investment to be completed by December 31, 2029. The project, to be carried out by subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd., includes 4 billion yuan in fixed assets such as buildings and equipment. The first two phases, totaling 3.09 billion yuan, are already completed with equipment being delivered, currently in customer sampling and trial production stages without mass production revenue yet. The third phase expands on existing land without new land acquisition. The company cites advanced packaging as key to 'beyond Moore's Law' for applications in smart terminals and high-performance computing. Biwin also has a惠州 facility for memory and SiP packaging. The company plans to reach 5,000 wafers per month capacity by end-2026 and 10,000 by end-2027, with revenue contribution expected from late 2026. In H1 2026, Biwin reported revenue of 15.575 billion yuan, up nearly 300% year-on-year, with net profit of 7.166 billion yuan.
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