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Biwin Storage plans 4.5 bln yuan investment in wafer-level advanced packaging Phase III
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Biwin Storage announced on September 22 that it and its subsidiary Guangdong Xinchenghanqi Semiconductor Technology Co., Ltd. plan to sign a project cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee to build Phase III of a wafer-level advanced packaging and testing manufacturing project, with a total estimated investment of approximately 4.5 billion yuan, including 4 billion yuan in fixed assets. The Phase III project, located in Dongguan Ecological Park, will expand wafer-level advanced packaging capacity on existing industrial land without requiring new land acquisition. The project is scheduled to complete fixed asset investment by December 31, 2029, with funding from Guangdong Xinchenghanqi's own and self-raised funds, including third-party capital increases and bank loans, not involving raised funds. Biwin Storage's Phase I and II of the project, with a planned investment of 3.09 billion yuan, have been completed, achieving a 2.5D monthly capacity of approximately 3,000 wafers. Phase I has completed factory construction and equipment installation, while Phase II equipment is being installed and is in customer sampling, process verification, and small-batch trial production stages, not yet generating mass production revenue. Guangdong Xinchenghanqi has built capabilities in 2.5D, RDL, Fan-in, and Fan-out advanced packaging technologies. Biwin Storage stated that Phase III will further expand wafer-level advanced packaging capabilities and promote industrialization and mass production of multi-chip system-in-package and memory-compute integrated packaging technologies.
Source report
Biwin Storage announced on the evening of September 22 that the company, together with its controlling subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd., plans to sign a project cooperation agreement with the Management Committee of Dongguan Songshan Lake High-Tech Industrial Development Zone. The agreement concerns the construction of Phase III of a wafer-level advanced packaging and testing manufacturing project, with a total estimated investment of approximately ¥4.5 billion, including ¥4 billion in fixed asset investment.
According to the announcement, Phase III will be located in Dongguan Ecological Park. The project involves additional investment and expansion within the existing industrial land, with no new land acquisition required. The main scope includes capacity expansion for wafer-level advanced packaging and testing, covering equipment investment and plant renovation. The project is scheduled to complete fixed asset investment by December 31, 2029. Funding will come from Guangdong Xincheng Hanqi's own funds and self-raised capital, including third-party capital increases and bank loans, and will not involve raised funds.
Currently, Phases I and II of Biwin Storage's wafer-level advanced packaging and testing manufacturing project have completed a planned investment of ¥3.09 billion, corresponding to a monthly 2.5D capacity of approximately 3,000 wafers. Phase I has completed plant construction and equipment installation and commissioning. Phase II equipment is being progressively installed and commissioned, and the project is currently in the stages of customer sampling, process validation, and small-batch trial production, with no formal mass production revenue generated yet.
On the technology front, Guangdong Xincheng Hanqi has established capabilities covering multiple advanced packaging technologies, including 2.5D, RDL, Fan-in, and Fan-out. Biwin Storage stated that Phase III will further expand wafer-level advanced packaging and testing capabilities based on the existing project, and will promote the industrialization and mass production of multi-chip system-in-package and memory-compute integrated packaging technologies.
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集微网Neutral / independent
Part of this Story
Biwin Storage Board Approves 4.5 Billion Yuan Phase III Investment Project