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Japan and US in talks over building chip factories as part of $550 billion investment package
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According to media reports cited by Cailian Press on September 17, Japan and the United States are currently engaged in negotiations regarding the construction of chip factories. These discussions are part of a broader $550 billion investment package. The report indicates that the two countries are working together on semiconductor manufacturing capacity, though specific details about the number of factories, timelines, or locations have not been disclosed. The talks highlight ongoing efforts to strengthen the semiconductor supply chain between the two allies amid global chip shortages and geopolitical tensions.
Source report
Cailian Press, Sept. 17 — According to media reports, Japan and the United States are currently in discussions regarding the construction of chip factories. These talks are part of broader negotiations surrounding a $550 billion investment package.
Source
财联社Eastern
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Japan and US negotiate trillion-yen semiconductor plant as part of $550 billion investment plan