Samsung Electronics wins US$200 billion Broadcom AI chip partnership

Published Jul 26, 07:56 AM UTC

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Samsung Electronics has secured a US$200 billion partnership with Broadcom to produce custom AI accelerators, marking a significant win for its foundry business. The deal comes as global technology companies increasingly develop their own custom AI chips. This partnership is expected to help Samsung narrow the gap with TSMC in the semiconductor foundry market. The announcement was made on July 26, 2026, by The Business Times Singapore.

Source

The Business TimesRegional

Original headline: Samsung Electronics wins US$200 billion Broadcom AI chip partnership, boosting foundry push

Original language: EN-US

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Samsung and Broadcom Sign $200 Billion AI Chip Partnership Deal

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Samsung Electronics TSMC