China Sets $4.2 Trillion Revenue Target for Electronics by 2030 in New Five-Year Plan
China's MIIT and NDRC jointly issued the 15th Five-Year Plan for the electronic information manufacturing industry, targeting revenue exceeding 30 trillion yuan ($4.2 trillion) by 2030. The plan prioritizes AI, aiming to transform the sector from scale to system leadership, with R&D intensity reaching 3.5%. It outlines 17 key tasks across four areas, including full-chain breakthroughs in integrated circuits, advanced computing, and smart terminals.
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China Unveils 15th Five-Year Plan for Electronics, Targeting $4.2 Trillion Revenue by 2030
China's Ministry of Industry and Information Technology and the National Development and Reform Commission released the '15th Five-Year Plan' for the electronic information manufacturing industry on April 15. The plan sets a target for revenue of enterprises above a designated size to exceed 30 trillion yuan (approximately $4.2 trillion) by 2030. It aims to significantly increase computing power supply and boost the adoption rate of next-generation smart terminals. The plan outlines a strategy to 'build foundations, improve quality, foster innovation, and enhance governance.' Key measures include strengthening the industrial base in areas like integrated circuits, electronic components, smart sensors, and the photonics industry to solve 'bottleneck' issues. It also focuses on enhancing the competitiveness of electronic systems and consumer electronics, such as high-end phones, PCs, VR, and wearables. The plan emphasizes seizing opportunities from AI development by improving computing hardware, expanding smart terminals, and deepening integrated applications. Experts quoted, including Ao Li from CAICT and Liu Bin from CEPREI, note the plan aims to build a self-controllable industrial base and accelerate the transformation of AI potential into economic growth. The plan also addresses 'involution-style' competition by improving industry regulations and capacity planning.
Read sourceChina unveils 15th Five-Year Plan to boost AI-powered smart terminal industry
China's Ministry of Industry and Information Technology and the National Development and Reform Commission have jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry', setting a target for revenue of enterprises above a designated size to exceed 30 trillion yuan by 2030. The plan aims to foster long-board technologies in integrated circuits, advanced computing, consumer electronics, and energy electronics, and to cultivate world-class competitive enterprises. It calls for R&D investment intensity to reach 3.5% and a significant increase in computing power supply and the adoption rate of new-generation smart terminals. Ao Li, vice president of the China Academy of Information and Communications Technology (CAICT), stated that the market expects higher-quality, smarter, and greener products, with 'replacement through innovation' as a key driver of consumption upgrades. The plan outlines 17 key tasks across four areas: foundation building, quality improvement, new growth cultivation, and governance. It specifically promotes the iterative upgrade of AI smartphones, PCs, smart glasses, and other terminals, and the deep integration of on-device large models with terminal products. Industry insiders predict that by 2026, sales of AI smartphones and AI computers will surpass those of non-AI products, marking a new cycle of intelligent replacement.
Read sourceChina Issues 15th Five-Year Plan for Electronic Information Manufacturing, Targets 30 Trillion Yuan Revenue
China's Ministry of Industry and Information Technology and the National Development and Reform Commission have jointly released the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan sets a target for the industry's revenue from enterprises above a designated size to exceed 30 trillion yuan by 2030. In 2025, the sector achieved revenue of 17.4 trillion yuan, a 7.4% year-on-year increase, maintaining its position as the top industrial sector in China for 13 consecutive years. The plan aims to significantly enhance the industry's supply chain security by 2030, fostering world-class enterprises in areas such as integrated circuits, advanced computing, consumer electronics, basic electronics, and energy electronics. It also targets a research and development investment intensity of 3.5%, breakthroughs in key core technologies, a substantial increase in computing power supply, and a significant rise in the adoption rate of next-generation smart terminals. The plan outlines 17 key tasks across four areas: strengthening the industrial foundation, enhancing the competitiveness of electronic products, cultivating new growth points, and improving sustainable development capabilities.
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China's 15th Five-Year Plan Targets 30 Trillion Yuan in Electronics Manufacturing Revenue by 2030
China's Ministry of Industry and Information Technology and the National Development and Reform Commission jointly released the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry,' setting a target for revenue of enterprises above a designated size to exceed 30 trillion yuan by 2030. The plan prioritizes artificial intelligence as a central theme, aiming to transform the industry from scale leadership to system leadership. Key targets include raising R&D intensity to 3.5% and achieving breakthroughs in integrated circuits, advanced computing, consumer electronics, basic electronics, and energy electronics. Experts cited include Ao Li of the China Academy of Information and Communications Technology, who noted the industry has led 41 industrial categories in revenue and export share for 13 consecutive years. Xiang Ligang of the Zhongguancun Information Consumption Alliance highlighted the ambitious growth from approximately 17 trillion yuan in 2025 to 30 trillion yuan by 2030. The plan deploys tasks across four dimensions: foundation building, chain strengthening, new growth cultivation, and sustainability. It specifically addresses bottlenecks in computing power including the 'memory wall,' 'power wall,' and interconnect bandwidth constraints, and promotes emerging areas such as energy electronics, spatiotemporal information, AI hardware, and industry digitalization. In energy electronics, the plan supports crystalline silicon solar cell upgrades and perovskite tandem cell development, with Liu Weijun of Guangyin Technology predicting perovskite could enter mass production within three to five years.
China's Electronics Manufacturing Plan Targets 30 Trillion Yuan Revenue by 2030, Focuses on AI
China's Ministry of Industry and Information Technology and the National Development and Reform Commission have jointly issued the 15th Five-Year Plan for the electronic information manufacturing industry, setting a revenue target of 30 trillion yuan by 2030. The plan emphasizes seizing opportunities in artificial intelligence to transform the sector from scale leadership to system leadership. Key goals include raising R&D investment intensity to 3.5% and advancing innovation in integrated circuits, advanced computing, and consumer electronics. Experts quoted, such as Ao Li and Xiang Ligang, highlight the shift from quantity to quality and the revolutionary role of advanced materials like diamond. The plan addresses bottlenecks like the 'storage wall' and 'power wall' in computing, and promotes emerging directions including energy electronics, spatiotemporal information, AI hardware, and digital transformation. Specific technologies mentioned include perovskite tandem solar cells and AI-enabled devices like smartphones, PCs, and smart glasses.
China's MIIT and NDRC Plan to Develop Intelligent Aerospace Electronics for Space Computing
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for breakthroughs in core technologies including radiation-hardened chips and devices, inter-satellite laser communication, onboard computing platforms, and high-precision navigation. It aims to accelerate the construction of an intelligent, modular, and generalized aerospace electronic product system, with a key focus on supporting the development of emerging industries such as space computing.
Read sourceChina's MIIT and NDRC Promote Unified High-Speed Computing Interconnect Bus Protocol
On September 15, it was reported that China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan aims to strengthen the hardware foundation for artificial intelligence by supporting technological breakthroughs and iterative product upgrades. It emphasizes enhancing coordination between AI chips and complete machine products, accelerating cloud training equipment development, and developing edge-side inference devices and chips for embodied intelligence and autonomous driving. The plan promotes the development and implementation of the unified protocol series specifications for the high-speed computing interconnect bus (CLink). It also calls for strengthening adaptation of AI chips with large models and databases, building public service platforms, and improving the AI chip standard system. Additionally, the plan drives iterative upgrades of AI smartphones, PCs, smart glasses, and other terminals, broadening usage scenarios and optimizing product experience.
Read sourceChina's MIIT and NDRC Plan to Develop Edge AI Chips and Processing-in-Memory
China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry' on September 15. The plan outlines strategic technology goals, including tackling edge AI computing chips and high-end memory chips, and developing new architectures such as near-memory computing and processing-in-memory. It also calls for research and development of edge operating systems, chip enablement software, and improved development environments including development frameworks, operator libraries, and inference acceleration engines. Additionally, the plan emphasizes algorithm architecture and lightweighting technologies, agent technologies, multi-model scheduling, and multi-agent collaboration systems. It further aims to develop high-dynamic, real-time posture and motion control technologies, and create embodied intelligence algorithm libraries, action libraries, and knowledge bases.
Read sourceChina's MIIT and NDRC Plan to Promote CLink Unified Protocol for AI Chip Interconnect
On September 15, the Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan aims to strengthen the hardware foundation for artificial intelligence by supporting technological breakthroughs and iterative upgrades of AI chips and complete system products. It specifically calls for accelerating the development of cloud-based training equipment and edge-side inference devices for fields like embodied intelligence and autonomous driving. A key initiative is the promotion of the CLink series specifications, a unified protocol for high-speed interconnect buses in computing. The plan also emphasizes strengthening adaptation between AI chips and large models and databases, establishing relevant public service platforms, and improving the AI chip standard system. Furthermore, it encourages continuous iterative upgrades for AI-powered products such as smartphones, PCs, smart glasses, and vehicle-mounted terminals, broadening their usage scenarios and optimizing user experiences.
Read sourceChina's MIIT and NDRC Issue Plan to Boost AI Chip Design Capabilities
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly released the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan emphasizes enhancing AI chip design capabilities and strengthening technological breakthroughs in areas such as tensor core dataflow organization, mixed precision, dynamic sparse computing, and unified memory architecture. It focuses on core performance metrics including low latency, high throughput, and low power consumption, aiming to improve the overall computing capabilities of processors such as General-Purpose Graphics Processing Units (GPGPUs), Application-Specific Integrated Circuits (ASICs), and System-on-Chips (SoCs). The plan also outlines new pathways, including hardware-software co-designed inference chips.
Read sourceChina to Promote Solid-State, Sodium-Ion, Flow Battery, Fuel Cell Industrialization
On September 15, it was reported that China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan outlines continued promotion of coordinated development in energy electronics technologies, including photovoltaics, energy storage, terminals, and information technology. It specifically calls for advancing high-efficiency crystalline silicon photovoltaic cell technology and developing next-generation technologies like perovskite tandem cells. The plan also aims to enhance innovation across the new-type battery industrial chain, consolidate lithium-ion battery advantages, and continue promoting the industrialization of solid-state batteries, sodium-ion batteries, flow batteries, and fuel cells. Additionally, it supports applications in smart terminals, new energy vehicles, ships, aviation, intelligent robots, construction machinery, and agricultural equipment, while accelerating key power electronics technology R&D and improving energy storage system integration and control.
Read sourceChina's MIIT and NDRC Issue Plan to Promote RISC-V R&D and AI Chip Applications
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '14th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan proposes advancing the research, development, and industrialization of the fifth-generation Reduced Instruction Set Computer (RISC-V) architecture. It specifically supports the application of RISC-V chips in artificial intelligence and embedded systems, calling for deepened collaborative innovation between chips and models, as well as co-design optimization of algorithms and hardware architectures. Additionally, the plan aims to consolidate competitive advantages in communication equipment by accelerating breakthroughs in high-end data communications, optical communications, mobile communications, satellite communications, and next-generation wireless short-range communications. It also seeks to promote intelligent upgrades of industrial control equipment, build an integrated industrial computing system, advance laser equipment development, and guide digitalized and intelligent development of radar equipment for emerging fields like intelligent driving and the low-altitude economy.
Read sourceChina Plans New Storage Products, Space Computing in 15th Five-Year Plan
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan outlines goals for advancing storage technology, including developing new products such as high-bandwidth flash, high-bandwidth memory, ferroelectric memory, resistive random-access memory (RRAM), and magnetoelectric memory. It also aims to improve distributed and hyper-converged storage systems, refine hierarchical data storage architectures, and achieve breakthroughs in intelligent tiered storage, data sparsification optimization, and key-value caching. In infrastructure and applications, the plan calls for breakthroughs in ultra-large-scale intelligent computing facility design to support AI clusters with hundreds of thousands of cards, accelerating the full-chain layout for space computing, and promoting deep coupling innovation between computing and electricity. Additionally, it targets tackling distributed edge computing architectures, strengthening applications of high-performance compilers, databases, and middleware, and overcoming bottlenecks in specialized accelerators and large-scale parallel computing to enhance the performance of Z-class supercomputers.
Read sourceChina's MIIT and NDRC Plan to Boost Processor Design and Chip Performance
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for enhancing microarchitecture design capabilities for various types of processors to improve the performance levels of computing chips. It also emphasizes breaking through common technical bottlenecks in the industry and developing supporting chip modules such as interconnects and power management components. This policy directive signals China's strategic intent to advance its domestic semiconductor design and manufacturing capabilities.
Read sourceChina's MIIT and NDRC Plan to Develop High-Bandwidth Memory and Space Computing
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for accelerating the development of advanced storage technologies, including high-bandwidth flash memory, high-bandwidth memory, ferroelectric memory, resistive random-access memory (RRAM), and magnetoelectric memory. It aims to improve distributed and hyper-converged storage systems and refine hierarchical data storage architectures. In infrastructure, the plan seeks breakthroughs in ultra-large-scale intelligent computing facility design to support AI clusters with hundreds of thousands of cards. It also aims to accelerate the full-chain deployment of space-based computing, promote deep coupling between computing and electricity, and tackle distributed edge computing architectures. Additionally, the plan targets breakthroughs in specialized accelerators and large-scale parallel computing to enhance the performance of Z-level supercomputers.
Read sourceChina's MIIT and NDRC Plan to Build Advanced Semiconductor and Photonics Manufacturing Platforms
On September 15, it was reported that China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan proposes advancing micro/nano fabrication platforms for key photonic technologies. Specifically, it promotes the construction of manufacturing process platforms for compound semiconductors of 6 inches and above, optical MEMS of 8 inches and above, and micro/nano-optical metasurface structures of 12 inches and above. The plan also calls for optoelectronic integration process platforms, focusing on enhancing low-cost mass production capabilities for silicon-based photonics of 8 inches and above and heterogeneous integration across multi-material systems. Furthermore, it aims to achieve breakthroughs in key technologies for multi-dimensional heterogeneous integration using advanced 12-inch processes, thereby promoting the construction of optoelectronic integration platforms.
Read sourceChina's MIIT and NDRC Issue Plan for Full-Chain Breakthroughs in Integrated Circuits
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for promoting full-chain breakthroughs in integrated circuits, targeting high-end chip products such as high-performance processors, high-density memory, and highly reliable analog and mixed-signal chips. It aims to enhance manufacturing capabilities by refining mature process nodes and improving advanced process nodes, while also promoting advanced packaging and testing technologies. The plan encourages quality upgrades in the wide-bandgap semiconductor industry and the industrialization of ultra-wide-bandgap semiconductors like gallium oxide and diamond. It emphasizes strengthening the supply capacity of key equipment, materials, and components, accelerating the development of electronic design automation (EDA) tools and intellectual property cores (IP cores), and driving technological breakthroughs in three-dimensional integration.
Read sourceChina's MIIT and NDRC Issue Plan to Boost RISC-V R&D and AI Chip Applications
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly released the '14th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for advancing the research, development, and industrialization of the fifth-generation Reduced Instruction Set Computing (RISC-V) architecture. It specifically supports the application of RISC-V chips in artificial intelligence and embedded systems, and emphasizes deepening chip-model collaborative innovation and strengthening co-design optimization between algorithms and hardware architectures. Additionally, the plan aims to consolidate competitive advantages in communication equipment by accelerating breakthroughs in high-end data communications, optical communications, mobile communications, satellite communications, and next-generation wireless short-range communications. It also promotes intelligent upgrades of industrial control equipment, encourages high-end development of laser equipment, guides digitalized and intelligent development of radar equipment for emerging sectors like intelligent driving and low-altitude economy, and aims to speed up technological breakthroughs in material handling equipment for next-generation smart manufacturing.
Read sourceChina's MIIT and NDRC Issue Plan to Boost High-End Electronic Components and Materials
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly released the '14th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan aims to promote the high-end development of electronic components and materials, focusing on key sectors including artificial intelligence, next-generation information and communications technology, aerospace, and new-generation smart terminals. It calls for accelerated development of mature, reliable 'shelf products' to form the industrial foundation, and supports electronic components such as circuits, connectors, electromechanical devices, sensors, and functional materials to evolve toward higher frequencies, faster speeds, greater integration, and enhanced reliability. The plan also encourages breakthroughs in high-performance electronic functional materials, packaging and assembly materials, and process and auxiliary materials to improve quality stability, reliability, and consistency. Additionally, it proposes establishing upstream-downstream coordination platforms, pilot testing platforms, and application verification centers, and leveraging the International Trading Center for Electronic Materials and the International Trading Center for Electronic Components and Integrated Circuits to develop the electronic distribution industry and enhance supply chain resilience.
Read sourceChina's MIIT and NDRC Issue Plan for Full-Chain Breakthroughs in Integrated Circuits
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for advancing full-chain breakthroughs in integrated circuits, targeting high-end chip products such as high-performance processors, high-density memory, and highly reliable analog and mixed-signal chips. It aims to enhance manufacturing capabilities by refining mature process nodes and improving advanced process nodes. The plan also promotes advanced packaging and testing technologies, encourages quality upgrades in the wide-bandgap semiconductor industry, and drives the industrialization of ultra-wide-bandgap semiconductors like gallium oxide and diamond. Additionally, it emphasizes strengthening the supply capacity of key equipment, materials, and components, accelerating the development of electronic design automation (EDA) tools and intellectual property cores (IP cores), and promoting technological breakthroughs in areas such as three-dimensional integration.
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