China issues 15th Five-Year Plan for full-chain breakthroughs in integrated circuits
On September 15, China’s MIIT and NDRC jointly issued the 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry. The plan targets full-chain breakthroughs in integrated circuits, including high-end processors, memory, and analog chips; advances in EDA tools, IP cores, 3D integration, RISC-V, AI chips, advanced storage, space computing, and new battery technologies. It also promotes semiconductor manufacturing platforms and unified interconnect protocols.
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China's MIIT and NDRC Plan to Develop Intelligent Aerospace Electronics for Space Computing
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for breakthroughs in core technologies including radiation-hardened chips and devices, inter-satellite laser communication, onboard computing platforms, and high-precision navigation. It aims to accelerate the construction of an intelligent, modular, and generalized aerospace electronic product system, with a key focus on supporting the development of emerging industries such as space computing.
Read sourceChina's MIIT and NDRC Promote Unified High-Speed Computing Interconnect Bus Protocol
On September 15, it was reported that China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan aims to strengthen the hardware foundation for artificial intelligence by supporting technological breakthroughs and iterative product upgrades. It emphasizes enhancing coordination between AI chips and complete machine products, accelerating cloud training equipment development, and developing edge-side inference devices and chips for embodied intelligence and autonomous driving. The plan promotes the development and implementation of the unified protocol series specifications for the high-speed computing interconnect bus (CLink). It also calls for strengthening adaptation of AI chips with large models and databases, building public service platforms, and improving the AI chip standard system. Additionally, the plan drives iterative upgrades of AI smartphones, PCs, smart glasses, and other terminals, broadening usage scenarios and optimizing product experience.
Read sourceChina's MIIT and NDRC Plan to Develop Edge AI Chips and Processing-in-Memory
China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry' on September 15. The plan outlines strategic technology goals, including tackling edge AI computing chips and high-end memory chips, and developing new architectures such as near-memory computing and processing-in-memory. It also calls for research and development of edge operating systems, chip enablement software, and improved development environments including development frameworks, operator libraries, and inference acceleration engines. Additionally, the plan emphasizes algorithm architecture and lightweighting technologies, agent technologies, multi-model scheduling, and multi-agent collaboration systems. It further aims to develop high-dynamic, real-time posture and motion control technologies, and create embodied intelligence algorithm libraries, action libraries, and knowledge bases.
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China's MIIT and NDRC Plan to Promote CLink Unified Protocol for AI Chip Interconnect
On September 15, the Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan aims to strengthen the hardware foundation for artificial intelligence by supporting technological breakthroughs and iterative upgrades of AI chips and complete system products. It specifically calls for accelerating the development of cloud-based training equipment and edge-side inference devices for fields like embodied intelligence and autonomous driving. A key initiative is the promotion of the CLink series specifications, a unified protocol for high-speed interconnect buses in computing. The plan also emphasizes strengthening adaptation between AI chips and large models and databases, establishing relevant public service platforms, and improving the AI chip standard system. Furthermore, it encourages continuous iterative upgrades for AI-powered products such as smartphones, PCs, smart glasses, and vehicle-mounted terminals, broadening their usage scenarios and optimizing user experiences.
Read sourceChina's MIIT and NDRC Issue Plan to Boost AI Chip Design Capabilities
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly released the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan emphasizes enhancing AI chip design capabilities and strengthening technological breakthroughs in areas such as tensor core dataflow organization, mixed precision, dynamic sparse computing, and unified memory architecture. It focuses on core performance metrics including low latency, high throughput, and low power consumption, aiming to improve the overall computing capabilities of processors such as General-Purpose Graphics Processing Units (GPGPUs), Application-Specific Integrated Circuits (ASICs), and System-on-Chips (SoCs). The plan also outlines new pathways, including hardware-software co-designed inference chips.
Read sourceChina to Promote Solid-State, Sodium-Ion, Flow Battery, Fuel Cell Industrialization
On September 15, it was reported that China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan outlines continued promotion of coordinated development in energy electronics technologies, including photovoltaics, energy storage, terminals, and information technology. It specifically calls for advancing high-efficiency crystalline silicon photovoltaic cell technology and developing next-generation technologies like perovskite tandem cells. The plan also aims to enhance innovation across the new-type battery industrial chain, consolidate lithium-ion battery advantages, and continue promoting the industrialization of solid-state batteries, sodium-ion batteries, flow batteries, and fuel cells. Additionally, it supports applications in smart terminals, new energy vehicles, ships, aviation, intelligent robots, construction machinery, and agricultural equipment, while accelerating key power electronics technology R&D and improving energy storage system integration and control.
Read sourceChina's MIIT and NDRC Issue Plan to Promote RISC-V R&D and AI Chip Applications
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '14th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan proposes advancing the research, development, and industrialization of the fifth-generation Reduced Instruction Set Computer (RISC-V) architecture. It specifically supports the application of RISC-V chips in artificial intelligence and embedded systems, calling for deepened collaborative innovation between chips and models, as well as co-design optimization of algorithms and hardware architectures. Additionally, the plan aims to consolidate competitive advantages in communication equipment by accelerating breakthroughs in high-end data communications, optical communications, mobile communications, satellite communications, and next-generation wireless short-range communications. It also seeks to promote intelligent upgrades of industrial control equipment, build an integrated industrial computing system, advance laser equipment development, and guide digitalized and intelligent development of radar equipment for emerging fields like intelligent driving and the low-altitude economy.
Read sourceChina Plans New Storage Products, Space Computing in 15th Five-Year Plan
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan outlines goals for advancing storage technology, including developing new products such as high-bandwidth flash, high-bandwidth memory, ferroelectric memory, resistive random-access memory (RRAM), and magnetoelectric memory. It also aims to improve distributed and hyper-converged storage systems, refine hierarchical data storage architectures, and achieve breakthroughs in intelligent tiered storage, data sparsification optimization, and key-value caching. In infrastructure and applications, the plan calls for breakthroughs in ultra-large-scale intelligent computing facility design to support AI clusters with hundreds of thousands of cards, accelerating the full-chain layout for space computing, and promoting deep coupling innovation between computing and electricity. Additionally, it targets tackling distributed edge computing architectures, strengthening applications of high-performance compilers, databases, and middleware, and overcoming bottlenecks in specialized accelerators and large-scale parallel computing to enhance the performance of Z-class supercomputers.
Read sourceChina's MIIT and NDRC Plan to Boost Processor Design and Chip Performance
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for enhancing microarchitecture design capabilities for various types of processors to improve the performance levels of computing chips. It also emphasizes breaking through common technical bottlenecks in the industry and developing supporting chip modules such as interconnects and power management components. This policy directive signals China's strategic intent to advance its domestic semiconductor design and manufacturing capabilities.
Read sourceChina's MIIT and NDRC Plan to Develop High-Bandwidth Memory and Space Computing
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for accelerating the development of advanced storage technologies, including high-bandwidth flash memory, high-bandwidth memory, ferroelectric memory, resistive random-access memory (RRAM), and magnetoelectric memory. It aims to improve distributed and hyper-converged storage systems and refine hierarchical data storage architectures. In infrastructure, the plan seeks breakthroughs in ultra-large-scale intelligent computing facility design to support AI clusters with hundreds of thousands of cards. It also aims to accelerate the full-chain deployment of space-based computing, promote deep coupling between computing and electricity, and tackle distributed edge computing architectures. Additionally, the plan targets breakthroughs in specialized accelerators and large-scale parallel computing to enhance the performance of Z-level supercomputers.
Read sourceChina's MIIT and NDRC Plan to Build Advanced Semiconductor and Photonics Manufacturing Platforms
On September 15, it was reported that China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan proposes advancing micro/nano fabrication platforms for key photonic technologies. Specifically, it promotes the construction of manufacturing process platforms for compound semiconductors of 6 inches and above, optical MEMS of 8 inches and above, and micro/nano-optical metasurface structures of 12 inches and above. The plan also calls for optoelectronic integration process platforms, focusing on enhancing low-cost mass production capabilities for silicon-based photonics of 8 inches and above and heterogeneous integration across multi-material systems. Furthermore, it aims to achieve breakthroughs in key technologies for multi-dimensional heterogeneous integration using advanced 12-inch processes, thereby promoting the construction of optoelectronic integration platforms.
Read sourceChina's MIIT and NDRC Issue Plan for Full-Chain Breakthroughs in Integrated Circuits
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for promoting full-chain breakthroughs in integrated circuits, targeting high-end chip products such as high-performance processors, high-density memory, and highly reliable analog and mixed-signal chips. It aims to enhance manufacturing capabilities by refining mature process nodes and improving advanced process nodes, while also promoting advanced packaging and testing technologies. The plan encourages quality upgrades in the wide-bandgap semiconductor industry and the industrialization of ultra-wide-bandgap semiconductors like gallium oxide and diamond. It emphasizes strengthening the supply capacity of key equipment, materials, and components, accelerating the development of electronic design automation (EDA) tools and intellectual property cores (IP cores), and driving technological breakthroughs in three-dimensional integration.
Read sourceChina's MIIT and NDRC Issue Plan to Boost RISC-V R&D and AI Chip Applications
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly released the '14th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for advancing the research, development, and industrialization of the fifth-generation Reduced Instruction Set Computing (RISC-V) architecture. It specifically supports the application of RISC-V chips in artificial intelligence and embedded systems, and emphasizes deepening chip-model collaborative innovation and strengthening co-design optimization between algorithms and hardware architectures. Additionally, the plan aims to consolidate competitive advantages in communication equipment by accelerating breakthroughs in high-end data communications, optical communications, mobile communications, satellite communications, and next-generation wireless short-range communications. It also promotes intelligent upgrades of industrial control equipment, encourages high-end development of laser equipment, guides digitalized and intelligent development of radar equipment for emerging sectors like intelligent driving and low-altitude economy, and aims to speed up technological breakthroughs in material handling equipment for next-generation smart manufacturing.
Read sourceChina's MIIT and NDRC Issue Plan to Boost High-End Electronic Components and Materials
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly released the '14th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan aims to promote the high-end development of electronic components and materials, focusing on key sectors including artificial intelligence, next-generation information and communications technology, aerospace, and new-generation smart terminals. It calls for accelerated development of mature, reliable 'shelf products' to form the industrial foundation, and supports electronic components such as circuits, connectors, electromechanical devices, sensors, and functional materials to evolve toward higher frequencies, faster speeds, greater integration, and enhanced reliability. The plan also encourages breakthroughs in high-performance electronic functional materials, packaging and assembly materials, and process and auxiliary materials to improve quality stability, reliability, and consistency. Additionally, it proposes establishing upstream-downstream coordination platforms, pilot testing platforms, and application verification centers, and leveraging the International Trading Center for Electronic Materials and the International Trading Center for Electronic Components and Integrated Circuits to develop the electronic distribution industry and enhance supply chain resilience.
Read sourceChina's MIIT and NDRC Issue Plan for Full-Chain Breakthroughs in Integrated Circuits
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for advancing full-chain breakthroughs in integrated circuits, targeting high-end chip products such as high-performance processors, high-density memory, and highly reliable analog and mixed-signal chips. It aims to enhance manufacturing capabilities by refining mature process nodes and improving advanced process nodes. The plan also promotes advanced packaging and testing technologies, encourages quality upgrades in the wide-bandgap semiconductor industry, and drives the industrialization of ultra-wide-bandgap semiconductors like gallium oxide and diamond. Additionally, it emphasizes strengthening the supply capacity of key equipment, materials, and components, accelerating the development of electronic design automation (EDA) tools and intellectual property cores (IP cores), and promoting technological breakthroughs in areas such as three-dimensional integration.
Read sourceChina's MIIT and NDRC Issue Plan to Boost EDA Tools, IP Cores, and 3D Integration
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for advancing full-chain breakthroughs in integrated circuits, including developing high-end chips such as high-performance processors and high-density memory. It aims to enhance manufacturing capabilities by refining mature process nodes and improving advanced nodes. The plan also promotes advanced packaging and testing technologies, quality upgrades in wide-bandgap semiconductors, and industrialization of ultra-wide-bandgap materials like gallium oxide and diamond. Additionally, it seeks to improve the supply of key equipment, materials, and components, accelerate EDA tool and IP core development, and promote technological breakthroughs in 3D integration.
Read sourceChina's MIIT and NDRC Issue Plan to Boost EDA Tools, IP Cores, and 3D Integration
On September 15, China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the '14th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' The plan calls for promoting breakthroughs across the entire integrated circuit (IC) industry chain. It targets the development of high-end chip products such as high-performance processors, high-density memory, and highly reliable analog and mixed-signal chips. The plan aims to enhance IC manufacturing capabilities by refining mature process nodes and improving advanced process node capabilities. It also promotes the development and application of advanced packaging and testing technologies. Additionally, the plan seeks to upgrade the quality and efficiency of the wide-bandgap semiconductor industry and advance the industrialization of ultra-wide-bandgap semiconductors like gallium oxide and diamond. Efforts will continue to improve the supply capacity of key equipment, materials, and components, with a specific focus on accelerating the development of electronic design automation (EDA) tools and intellectual property cores (IP cores), and promoting technological breakthroughs and applications in areas such as 3D integration.
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