Biwin Storage invests 4.5 billion yuan in Phase III of wafer-level advanced packaging project in Dongguan
Biwin Storage (688525.SH) announced plans to invest approximately 4.5 billion yuan (4 billion yuan in fixed assets) in Phase III of its wafer-level advanced packaging and testing manufacturing project in Dongguan's Songshan Lake High-Tech Zone. The project, implemented with subsidiary Guangdong Xincheng Hanqi, expands on existing land without new acquisition. Funding comes from own and self-raised capital, not raised funds. The company aims to strengthen the Greater Bay Area's semiconductor competitiveness and advance multi-chip system-in-package and memory-compute integration technologies.
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Common ground
- Advanced packaging is strategically important for China's semiconductor self-reliance.
- The US export controls create genuine urgency for building domestic capacity.
- Biwin's Phase III investment is a high-stakes bet with potential geopolitical necessity.
- Both sides agree that transparency on Phase I and II progress would be beneficial.
Points of contention
- Neutral Agent sees the investment as a risky land grab without proof of returns, while Eastern Agent views it as a necessary strategic move for survival.
- Eastern Agent argues that parallel phasing is standard industry practice, but Neutral Agent says Biwin lacks the track record of companies like TSMC.
- Neutral Agent demands financial transparency and utilization data, while Eastern Agent says that's a Western financial trap that ignores geopolitical timing.
- Eastern Agent claims Biwin is its own anchor customer through vertical integration, but Neutral Agent says that just shifts risk within the company.
- Neutral Agent warns of a subsidy trap where companies overbuild for incentives, while Eastern Agent says Chinese industrial policy uses performance gates, not blank checks.
Blind spots
- Neither side fully addresses the debt structure and whether Biwin can survive a 20% revenue drop.
- The debate overlooks the human-capital challenge—building a fab without the engineering team to run it could lead to idle capacity.
- Both agents ignore the opportunity cost of spending on fixed assets instead of R&D or customer relationships.
- There's no discussion of how Biwin's competitive moat compares to established players like JCET and Hua Tian.
WorldAttention’s read
This roundtable reveals a fundamental clash between financial discipline and geopolitical urgency. The Neutral Agent insists on transparency and capital efficiency, arguing that Biwin's Phase III investment lacks proof of returns from earlier phases and risks being a subsidy-driven land grab. The Eastern Agent counters that in a contested technology environment where US export controls are tightening, waiting for perfect data is a luxury China can't afford—strategic survival demands building capacity now, even if it means accepting higher risk. Both sides agree on the strategic importance of advanced packaging and the need for some transparency, but they disagree on whether Biwin's move is prudent or reckless. The blind spots include the debt structure, human-capital readiness, and competitive positioning against established players. Ultimately, this is a high-stakes bet that could pay off if demand materializes and export controls tighten, but it remains financially opaque—and that tension between necessity and accountability is the real issue.
Reporting timeline
Biwin Storage Plans 4.5 Billion Yuan Investment for Wafer-Level Advanced Packaging Project Phase 3
Biwin Storage (688525.SH) announced via a filing that it plans to invest approximately 4.5 billion yuan (with 4 billion yuan in fixed assets) in the third phase of its wafer-level advanced packaging and testing manufacturing project. The project will be implemented by the company and its controlling subsidiary Guangdong Xincheng Hanqi, which is also the entity for phases one and two. A cooperation agreement will be signed with the Songshan Lake High-Tech Industrial Development Zone Management Committee in Dongguan. The company stated that the project aims to meet market opportunities, enhance competitiveness, and strengthen the Greater Bay Area's position in the global semiconductor industry. It is expected to boost independent innovation, achieve breakthroughs in key wafer-level advanced packaging technologies, and promote the industrialization and mass production of multi-chip system-in-package and memory-compute integration technologies, thereby contributing to the security of the semiconductor supply chain.
Read sourceChinese Memory Chip Maker Biwin Storage Announces $6.3 Billion Advanced Packaging Project Expansion
Biwin Storage, a Chinese memory chip company, announced on September 22 that it plans to invest approximately 4.5 billion yuan ($6.3 billion) in the third phase of its wafer-level advanced packaging and testing project in Dongguan's Songshan Lake High-Tech Zone. The project, undertaken by subsidiary Guangdong Xincheng Hanqi Semiconductor Technology, will involve 4 billion yuan in fixed assets. Phases one and two, totaling 3.09 billion yuan, are already completed with equipment being delivered, currently in customer sampling and trial production stages without mass production revenue yet. The third phase expands on existing land without requiring new land acquisition. Funding will come from the subsidiary's own resources and self-raised funds, including third-party capital increases and bank loans, not from raised funds. Biwin Storage stated the project will strengthen the Greater Bay Area's competitiveness in the global semiconductor industry and advance key technologies in multi-chip system-in-package and memory-compute integration.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment in Wafer-Level Advanced Packaging Project Phase 3
Biwin Storage (688525) announced on September 22 that it, along with its controlling subsidiary Guangdong Xincheng Hanqi, plans to sign a cooperation agreement with the Dongguan Songshan Lake New Technology Industrial Development Zone Management Committee to invest in the construction of Phase 3 of a wafer-level advanced packaging and testing manufacturing project. The total investment for the project is approximately 4.5 billion yuan (about 45 billion yuan), including 4 billion yuan in fixed asset investment. The announcement was reported by Renmin Caixun on September 22 and published by Securities Times Network.
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Biwin Storage Plans 4.5 Billion Yuan Investment in Advanced Packaging Project Phase III
On September 22, Biwin Storage (688525.SH) announced that the company and its controlling subsidiary Guangdong Xincheng Hanqi plan to sign a cooperation agreement with the Songshan Lake High-tech Zone Management Committee in Dongguan to invest in the construction of Phase III of a wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan, including 4 billion yuan in fixed asset investment. The project does not involve new land acquisition and will be built within the existing industrial land. The company stated that this investment is an expansion based on the original project, with funding from its own and self-raised capital, and does not involve raised funds.
Read sourceBiwin Storage Signs 4.5 Billion Yuan Crystal-Level Advanced Packaging Project Agreement in Dongguan
Biwin Storage (688525.SH) announced on September 22 that it, along with its controlling subsidiary Guangdong Xincheng Hanqi, plans to sign a tripartite agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee for Phase III of a Crystal-Level Advanced Packaging Manufacturing Project. The total investment is approximately 4.5 billion yuan, including 4 billion yuan in fixed assets such as buildings, structures, and equipment. The project aims to strengthen the Greater Bay Area's competitiveness in the global semiconductor industry, boost China's integrated circuit industry, and enhance independent innovation capabilities. It will focus on breakthroughs in key semiconductor wafer-level advanced packaging technologies, promote multi-chip system-in-package and memory-compute integration technology industrialization and mass production, and improve the security of the semiconductor industry supply chain.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Phase III Project in Dongguan Songshan Lake
Biwin Storage announced that it plans to sign a project cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee for the construction of Phase III of its wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan, including 4 billion yuan in fixed asset investment. The company had previously disclosed investment matters for Phase I and Phase II of the project. On September 21, 2026, the company's board of directors reviewed and approved the relevant proposal. The project agreement will be signed as soon as possible, and this external investment does not require shareholder approval.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment for Advanced Packaging Project Phase Three
Biwin Storage announced on September 22 via Jin10 Data that it, along with its subsidiary Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd., plans to sign a tripartite agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee for the third phase of its wafer-level advanced packaging and testing manufacturing project. The total estimated investment for this phase is approximately 4.5 billion yuan, including 4 billion yuan in fixed assets such as buildings, structures, and equipment. The investment will be made in stages based on actual project progress. Guangdong Xincheng Hanqi has already established capabilities in various advanced packaging technologies, including 2.5D, RDL, Fan-in, and Fan-out. The third phase represents an expansion of the existing project, to be carried out within the current industrial land without requiring additional land acquisition.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment in Wafer-Level Advanced Packaging Project Phase III
Biwin Storage (688525.SH) announced on September 22 that it, along with its controlling subsidiary Guangdong Xinchenghanqi, plans to sign a cooperation agreement with the Dongguan Songshan Lake High-Tech Zone Management Committee to invest in the third phase of a wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan, including 4 billion yuan in fixed assets. The project does not involve new land acquisition and will be built within the original project's industrial land. The company stated that this investment is an expansion of production capacity based on the original project, with funding coming from its own and self-raised funds, and does not involve raised funds.
Biwin Storage Plans $6.3 Billion Investment in Wafer-Level Advanced Packaging Project Phase 3
Biwin Storage (688525) announced on September 22 that it, together with its subsidiary Guangdong Xincheng Hanqi, plans to sign a tripartite agreement with the Dongguan Songshan Lake New Technology Industrial Development Zone Management Committee to invest in Phase 3 of a wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan (about $630 million), including 4 billion yuan in fixed assets. The project is located in Dongguan, Guangdong Province, China.
Read sourceBiwin Storage Plans 4.5 Billion Yuan Investment in Wafer-Level Advanced Packaging Project Phase 3
Biwin Storage (688525) announced on September 22 that it, together with its controlling subsidiary Guangdong Xincheng Hanqi, plans to sign a cooperation agreement with the Dongguan Songshan Lake New Technology Industry Development Zone Management Committee. The agreement is for the third phase of a wafer-level advanced packaging and testing manufacturing project, with a total investment of approximately 4.5 billion yuan, including 4 billion yuan in fixed assets. The announcement was reported by People's Financial Information on September 22.
Read sourceBiwin Storage signs 4.5 billion yuan wafer-level advanced packaging project agreement with Dongguan Songshan Lake
Biwin Storage (688525.SH) announced on September 22 that it, together with its controlling subsidiary Guangdong Xincheng Hanqi, plans to sign a tri-phase cooperation agreement with the Dongguan Songshan Lake High-tech Industrial Development Zone Management Committee for a wafer-level advanced packaging and testing manufacturing project. The total investment is approximately 4.5 billion yuan, including 4 billion yuan in fixed assets such as buildings, structures, and equipment. The project aims to strengthen the Greater Bay Area's competitiveness in the global semiconductor industry, promote breakthroughs in key wafer-level advanced packaging technologies, and advance the industrialization and mass production of multi-chip system-in-package and memory-computing integrated packaging technologies, thereby enhancing the security of the semiconductor supply chain.
Read sourceBiwin Storage Board Approves 4.5 Billion Yuan Phase III Investment Project
Biwin Storage announced that its board of directors has approved an investment of approximately 4.5 billion yuan (including 4 billion yuan in fixed assets) for Phase III of its wafer-level advanced packaging and testing manufacturing project. The company will sign a project cooperation agreement with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee. The agreement is expected to be signed soon, and the investment does not require shareholder approval. This follows previously disclosed Phase I and Phase II investments in the same project.
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