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AAC Technologies and Intel announce liquid cooling ecosystem partnership
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On September 23, AAC Technologies announced a liquid cooling ecosystem partnership with Intel, according to a post on AAC's official WeChat account. The two companies plan to jointly advance liquid cooling technology for high-density servers and rack-level architectures. The collaboration will focus on developing core liquid cooling components, system-level solutions, and verification capabilities. Specific areas of cooperation include CPU cold plates, memory and SSD liquid cooling, quick disconnects (UQD/QD), manifolds, coolant distribution units (CDUs), as well as complete node and rack-level liquid cooling solutions. This partnership aims to address the growing thermal management demands of high-performance computing and data center infrastructure.
Source report
September 23 — AAC Technologies has announced a liquid cooling ecosystem partnership with Intel, according to the company's official WeChat account.
The two parties plan to jointly advance collaboration on liquid cooling technologies designed for high-density servers and rack-level architectures.
The partnership will focus on three key areas:
- Core liquid cooling components
- System-level solutions
- Verification capability development
Specific areas of collaboration include:
- CPU cold plates
- Memory and SSD liquid cooling
- UQD/QD quick disconnects
- Manifolds
- CDUs (Coolant Distribution Units)
- Full-node and rack-level liquid cooling solutions
Source
金十数据Neutral / independent
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AAC Technologies and Intel form liquid cooling ecosystem partnership for data centers