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AAC Technologies and Intel announce liquid cooling ecosystem partnership
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On September 23, AAC Technologies announced a liquid cooling ecosystem partnership with Intel, according to its official WeChat account. The two companies plan to jointly advance liquid cooling technology for high-density servers and rack-level architectures. The collaboration will focus on developing core liquid cooling components, system-level solutions, and verification capabilities. Specific areas of cooperation include CPU cold plates, memory and SSD liquid cooling, UQD/QD quick connectors, manifolds, CDUs (Coolant Distribution Units), as well as complete node and rack-level liquid cooling solutions for servers.
Source report
September 23, 2024 — AAC Technologies has announced a strategic partnership with Intel to jointly develop liquid cooling ecosystem solutions, according to the company's official WeChat account.
The collaboration aims to advance liquid cooling technologies tailored for high-density servers and rack-level architectures. Key areas of cooperation include:
- Core liquid cooling components: CPU cold plates, memory and SSD liquid cooling solutions
- System-level solutions: UQD/QD quick disconnects, manifolds, and CDUs (Coolant Distribution Units)
- Verification capabilities: Full-node and rack-level liquid cooling system validation
The partnership will focus on building integrated capabilities across component design, system integration, and performance verification.
Source
财联社Eastern
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