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Samsung HBM4 production capacity may double next year, industry sources say
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According to industry sources cited by Jin10 Data on September 21, Samsung Electronics is planning to significantly increase its production capacity for next-generation High Bandwidth Memory (HBM4 and HBM4E). The report indicates that Samsung intends to raise the monthly outsourcing volume for cleaning glass carriers used in HBM manufacturing from 20,000 units this year to 50,000 units next year, a 2.5-fold increase. Glass carriers are reusable support structures temporarily attached to DRAM wafers during the etching and drilling processes to prevent bending or breakage. While actual usage depends on input methods and yield rates, analysts suggest that a 2.5-fold increase in cleaning demand implies a high probability that Samsung's HBM4 series production volume will at least double next year. Samsung is actively preparing to expand capacity for both HBM4 and HBM4E, which utilize stacks of 12 or more layers.
Source report
September 21 — Industry sources indicate that Samsung is planning to significantly increase its outsourced cleaning volume for glass carriers used in HBM (High Bandwidth Memory) manufacturing.
According to the reports, the company aims to raise the monthly cleaning volume from 20,000 units this year to 50,000 units per month by next year — a fivefold increase compared to the 10,000 units per month recorded last year.
Role of Glass Carriers in HBM Production
Glass carriers serve as temporary support structures attached to the bottom of DRAM wafers during the HBM manufacturing process. Their primary function is to prevent wafers from bending or cracking during etching and drilling procedures.
Since glass carriers are reusable, actual consumption depends on wafer input methods and process yield rates. However, a 2.5x increase in cleaning demand strongly suggests that Samsung's HBM4 series production volume could at least double next year.
Expansion Plans for HBM4 and HBM4E
Samsung is actively preparing to expand production capacity for both HBM4 and HBM4E products. Both models feature high-stack architectures with 12 or more layers.
Source
金十数据Regional
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