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SemiDrive completes C+ and C++ rounds, total Series C reaches about 1 billion yuan
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On September 21, automotive-grade chip company SemiDrive announced the completion of its C+ and C++ funding rounds, bringing the total C round financing to approximately 10 billion yuan (about $1.4 billion). The new rounds attracted investment from multiple institutions and industrial capital, including Huadeng Technology, Shaanxi Investment Fund, Shaanxi Financial Assets, and New Era Capital. The funds raised will be primarily directed toward core technology research and product development. Specifically, the company aims to consolidate its technological leadership in intelligent cockpit and vehicle control chips, accelerate the extension of its automotive-grade product capabilities to smart terminal scenarios such as embodied intelligence, and increase self-developed technology investment in related fields.
Source report
人民财讯9月21日电 9月21日，车规级芯片企业芯驰科技宣布完成C+轮和C++轮融资。此前于2026年完成的C轮融资总额约为10亿元。
本轮融资的投资方涵盖华登科技、陕投基金、陕西金资、新时代资本等多家投资机构及产业资本。
所融资金将重点投向以下领域：
- 核心技术研发与产品化落地：持续巩固智能座舱与车控芯片的技术领先优势
- 跨场景技术布局：加速将车规级产品能力向具身智能等智能终端场景延伸，深化跨场景技术布局
- 技术自研投入：加大相关领域的技术自主研发投入
Source
证券之星-证券要闻Eastern
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Chinese chipmaker SemiDrive closes C+ and C++ rounds, total C round reaches about 1 billion yuan