Biren Technology wins $174M sole-source bid for Kunlun Lingyi AI computing center GPUs
Shanghai Biren Technology won a 174 million yuan ($24 million) sole-source contract to supply Bili series GPUs for Phase 1 of the Kunlun Lingyi Intelligent Computing Center. The company scored 89.71 points and must deliver within 45 days. A second package worth 452 million yuan was declared void due to insufficient bidders, highlighting concentration in China's domestic AI chip supply chain.
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BirenTech Wins $174M GPU Deal for Kunlun Lingyi AI Computing Center
Shanghai Biren Technology Co., Ltd. (壁仞科技) has won a 174 million yuan ($24 million) contract to supply GPUs for the first phase of the Kunlun Lingyi Intelligent Computing Center project. The company was the sole bidder for Package 1, scoring 89.71 points to rank first. The total project budget is approximately 626 million yuan, split into two packages; Package 2, valued at 452 million yuan, was declared void due to insufficient bidders, highlighting the concentration and scarcity in China's domestic AI computing supply chain. Biren will deliver its Bili series GPUs within 45 days of contract signing. The article details Biren's product lineup, including the BR106 (mass-produced in 2023), BR166 (chiplet design), and BR110 (edge/cloud inference), with the next-generation BR20X chip targeting 2026. Biren's BLink protocol enables direct GPU-to-GPU connectivity at up to 64 GB/s per channel, and its OCS optical circuit switching solution has delivered a 2,048-GPU cluster with 95% linear scaling efficiency. The company's BIRENSUPA software platform supports major Chinese AI models including GLM, DeepSeek, Qwen, and Kimi, with Day 0 compatibility.
Read sourceBirenTech Wins $174M Bid for AI Compute Project Amid Supply Chain Scarcity
Shanghai Biren Technology Co., Ltd. (壁仞科技) has won a 174 million yuan ($24 million) bid for Package 1 of the Kunlun Lingyi Intelligent Computing Center Project (Phase 1), becoming the sole supplier for that package. The total procurement budget for the project is approximately 626 million yuan, split into two packages. Package 1, valued at 174 million yuan, was awarded to BirenTech with a score of 89.71 points. The company must complete delivery within 45 calendar days of contract signing. Package 2, with a budget of 452 million yuan, was declared void due to fewer than three suppliers submitting bids, highlighting the concentration and scarcity of domestic AI compute supply chains. BirenTech's core product for the bid is its Bili series GPU, based on a classic GPGPU architecture with dedicated tensor compute units. The company has three product generations: BR106 (mass-produced in 2023), BR166 (chiplet design), and BR110 (edge and cloud inference). Its next-generation flagship training-inference chip, BR20X, targets a 2026 launch. BirenTech also detailed its proprietary BLink protocol for GPU direct connectivity and OCS optical circuit switching for scale-out, having delivered a 2048-card optical interconnect GPU supernode cluster by end of 2025 with a 95% linear speedup ratio. Its BIRENSUPA software platform supports major AI frameworks and models from Chinese firms like GLM, DeepSeek, Qwen, and Kimi.
Biren Technology Wins $1.74 Billion AI Computing Contract for Kunlun Lingyi Project
On September 24, the Kunlun Lingyi Intelligent Computing Center Project (Phase I) announced its procurement results. Shanghai Biren Technology Co., Ltd. won Package 1 with a bid of 174 million yuan (approximately $24 million), becoming the sole supplier for that package. The total procurement budget for the project is about 626 million yuan, split into two packages: Package 1 at 174 million yuan and Package 2 at 452 million yuan. Biren Technology scored 89.71 points, ranking first overall. The company must deliver within 45 calendar days after signing the contract. Notably, Package 2 was declared void due to insufficient suppliers (fewer than three), highlighting the concentration and scarcity of the domestic AI computing supply chain. Biren's core product for this contract is the Bili series GPU, based on a classic GPGPU architecture with integrated T-Core tensor computing units. The company has developed three product generations (BR106, BR110, BR166) and plans to launch its next-generation flagship training/inference chip BR20X in 2026, supporting FP8/FP4 formats with larger memory and high interconnect bandwidth. Biren's proprietary BLink protocol enables direct GPU-to-GPU connections with up to 64 GB/s per channel, supporting 8-card point-to-point direct interconnection.
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Biren Technology Wins $174M AI GPU Contract for Kunlun Lingyi Computing Center
On September 24, Biren Technology (壁仞科技) was announced as the sole winning bidder for Package 1 of the Kunlun Lingyi Intelligent Computing Center project (Phase 1), with a bid of 174 million yuan ($24 million). The project's total budget is approximately 626 million yuan, split into two packages. Package 2, with a budget of 452 million yuan, was declared void due to insufficient bidders, highlighting the concentration and scarcity of the domestic AI computing supply chain. Biren's winning product is its Bili series GPU, based on a classic GPGPU architecture with integrated tensor cores. The company has a three-generation product matrix (BR106, BR110, BR166) and differentiates itself with its proprietary BLink interconnect protocol and OCS optical circuit switching for scale-out, having delivered a 2048-GPU optical interconnect cluster. Biren reports Day 0 compatibility with major Chinese AI models like GLM, DeepSeek, Qwen, and Kimi. The company achieved 2025 revenue of 1.035 billion yuan (up 207.2% YoY) and a gross margin of 53.8%. It was listed on the Hong Kong Stock Exchange on January 2, 2026, as the 'first GPU stock in Hong Kong,' raising 5.583 billion HKD. Its next-generation flagship chip, the BR20X, is planned for 2026.
Read sourceChinese GPU Maker Biren Technology Wins $174M AI Computing Center Bid, Must Deliver in 45 Days
Shanghai Biren Technology Co., Ltd. has won a 174 million yuan ($24 million) sole-source bid for Package 1 of the Kunlun Lingyi Intelligent Computing Center Project (Phase 1), according to a September 24 report by 快科技. The total procurement budget for the project is approximately 626 million yuan, split into two packages. Biren scored 89.71 points, ranking first overall, and must complete delivery within 45 calendar days of contract signing. The core product is the Bili series GPU, based on a classic GPGPU architecture with integrated T-Core tensor units. Biren has developed three product generations (BR106, BR110, BR166) and plans a next-generation flagship training/inference chip, BR20X, targeting a 2026 launch with support for FP8/FP4 formats and larger memory. The company highlights its BLink interconnect protocol, achieving up to 64 GB/s per channel for 8-card direct connections, and an OCS optical circuit switching solution for scale-out, with a 2,048-card cluster achieving 95% linear acceleration. Biren's software platform supports major AI frameworks and models including GLM, DeepSeek, Qwen, and Kimi. Notably, Package 2, with a budget of over 452 million yuan, was declared void due to fewer than three suppliers submitting bids, reflecting the concentration and scarcity of domestic AI computing supply chains.