XIN Summit 2025 in Shenzhen: Final Booths Available for Smart Hardware Event
The XIN Summit 2025, a flagship technology event powered by BEYOND Expo, is scheduled to take place on November 15–16, 2025, at Cloud City in Shenzhen’s Nanshan District. Dedicated to smart hardware innovation, the summit serves as a central hub for the Greater Bay Area’s tech ecosystem, focusing on AI hardware, robotics, and advanced manufacturing. The event expects to attract over 5,000 industry professionals and more than 150 exhibitors, facilitating technology exchange, investment cooperation, and business networking. With booth reservations nearing capacity, only 20 exhibition spots remain, prompting organizers to urge early registration. Exhibitors gain access to a targeted professional audience, multi-platform media coverage, and strategic capital opportunities, including the debut of the Fund at First Pitch (FAFP) program in Shenzhen. To support global innovators, limited-time early-bird discounts are available for both standard booths and exclusive Media Day passes. This summit represents a significant opportunity for companies to enhance brand visibility and secure partnerships within the global AI innovation landscape during Shenzhen Tech Week.
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XIN Summit 2025 in Shenzhen: Final Booths Available for Smart Hardware Event
The XIN Summit 2025, a flagship technology event powered by BEYOND Expo, is scheduled to take place on November 15–16, 2025, at Cloud City in Shenzhen’s Nanshan District. Dedicated to smart hardware innovation, the summit serves as a central hub for the Greater Bay Area’s tech ecosystem, focusing on AI hardware, robotics, and advanced manufacturing. The event expects to attract over 5,000 industry professionals and more than 150 exhibitors, facilitating technology exchange, investment cooperation, and business networking. With booth reservations nearing capacity, only 20 exhibition spots remain, prompting organizers to urge early registration. Exhibitors gain access to a targeted professional audience, multi-platform media coverage, and strategic capital opportunities, including the debut of the Fund at First Pitch (FAFP) program in Shenzhen. To support global innovators, limited-time early-bird discounts are available for both standard booths and exclusive Media Day passes. This summit represents a significant opportunity for companies to enhance brand visibility and secure partnerships within the global AI innovation landscape during Shenzhen Tech Week.
TechNode