TSMC to Launch Munich Design Centre in Q3 for European Chip Support
At the 2025 Europe Technology Symposium, Paul de Bot, General Manager of the European Semiconductor Manufacturing Company (ESMC), announced that TSMC will open its Munich Design Centre in the third quarter. This new facility is strategically designed to support chip design customers utilizing the ESMC fabrication plant. The primary objective is to assist European clients in developing high-density, high-performance, and energy-efficient semiconductor solutions. The centre will specifically target key sectors including automotive, industrial manufacturing, artificial intelligence (AI), and Internet of Things (IoT) applications. This development follows TSMC's August 2023 announcement regarding a joint investment with major European semiconductor firms Bosch, Infineon, and NXP to establish the ESMC in Dresden, Germany. The Munich Design Centre represents a significant expansion of TSMC's footprint in Europe, aiming to strengthen local supply chains and provide specialized technical support for advanced node designs. By integrating design capabilities closer to its manufacturing partners, TSMC seeks to enhance collaboration and accelerate innovation within the European semiconductor ecosystem, addressing the growing demand for specialized chips in critical industries.
Wire timeline
TSMC to Launch Munich Design Centre in Q3 for European Chip Support
At the 2025 Europe Technology Symposium, Paul de Bot, General Manager of the European Semiconductor Manufacturing Company (ESMC), announced that TSMC will open its Munich Design Centre in the third quarter. This new facility is strategically designed to support chip design customers utilizing the ESMC fabrication plant. The primary objective is to assist European clients in developing high-density, high-performance, and energy-efficient semiconductor solutions. The centre will specifically target key sectors including automotive, industrial manufacturing, artificial intelligence (AI), and Internet of Things (IoT) applications. This development follows TSMC's August 2023 announcement regarding a joint investment with major European semiconductor firms Bosch, Infineon, and NXP to establish the ESMC in Dresden, Germany. The Munich Design Centre represents a significant expansion of TSMC's footprint in Europe, aiming to strengthen local supply chains and provide specialized technical support for advanced node designs. By integrating design capabilities closer to its manufacturing partners, TSMC seeks to enhance collaboration and accelerate innovation within the European semiconductor ecosystem, addressing the growing demand for specialized chips in critical industries.
TechNode