TSMC Kumamoto Plant to Supply Initial Output to Sony and Denso
Yuichi Horita, President of JASM (Taiwan Semiconductor Manufacturing Company’s Japanese subsidiary), announced that TSMC’s first semiconductor fabrication plant in Kumamoto, Japan, is scheduled to begin mass production by the end of this year. According to reports from the Taiwanese media outlet Commercial Times, the initial output from this facility will be supplied to key clients Sony and Denso. Horita emphasized that the production standards in Japan will strictly match the high quality of TSMC’s existing facilities in Taiwan. The first plant focuses on mature 22/28nm and 12/16nm process technologies. Additionally, plans for a second Kumamoto plant were highlighted, which will target advanced 6/7nm processes. Construction for this second facility is expected to commence in the first quarter of 2025, with mass production targeted for late 2027. Together, the two plants are projected to achieve a combined monthly production capacity exceeding 100,000 wafers. This development marks a significant expansion of TSMC’s global manufacturing footprint and strengthens supply chain resilience for major Japanese electronics and automotive industries.
Wire timeline
TSMC Kumamoto Plant to Supply Initial Output to Sony and Denso
Yuichi Horita, President of JASM (Taiwan Semiconductor Manufacturing Company’s Japanese subsidiary), announced that TSMC’s first semiconductor fabrication plant in Kumamoto, Japan, is scheduled to begin mass production by the end of this year. According to reports from the Taiwanese media outlet Commercial Times, the initial output from this facility will be supplied to key clients Sony and Denso. Horita emphasized that the production standards in Japan will strictly match the high quality of TSMC’s existing facilities in Taiwan. The first plant focuses on mature 22/28nm and 12/16nm process technologies. Additionally, plans for a second Kumamoto plant were highlighted, which will target advanced 6/7nm processes. Construction for this second facility is expected to commence in the first quarter of 2025, with mass production targeted for late 2027. Together, the two plants are projected to achieve a combined monthly production capacity exceeding 100,000 wafers. This development marks a significant expansion of TSMC’s global manufacturing footprint and strengthens supply chain resilience for major Japanese electronics and automotive industries.
TechNode