TSMC Completes Risk Production of 2nm Process with 5,000 Wafers
Taiwan Semiconductor Manufacturing Company (TSMC) has successfully completed limited risk production of approximately 5,000 wafers using its advanced 2nm process at its Baoshan fab in Hsinchu Science Park. This milestone indicates that the technology is progressing steadily and remains on track for scheduled mass production in 2025. The 2nm process utilizes new Gate-All-Around (GAA) nanosheet transistors and N2 NanoFlex design, offering significant improvements over the previous 3nm generation, including a 15% performance boost or 24-35% power reduction at the same voltage. TSMC plans to expand 2nm production to both Baoshan and Kaohsiung facilities. Chairman C. C. Wei noted that customer demand for 2nm chips is surpassing that of 3nm, driven by high-performance computing and chiplet designs, without affecting adoption rates. Additionally, TSMC introduced the N2P extension for smartphones and HPC, with mass production set for the second half of 2026. Market analysts suggest that NVIDIA's AI-driven growth could potentially make it TSMC's largest customer by late 2025, overtaking Apple. This development underscores TSMC's continued leadership in semiconductor innovation and its strategic capacity expansion to meet rising global demand for next-generation chips.
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TSMC Completes Risk Production of 2nm Process with 5,000 Wafers
Taiwan Semiconductor Manufacturing Company (TSMC) has successfully completed limited risk production of approximately 5,000 wafers using its advanced 2nm process at its Baoshan fab in Hsinchu Science Park. This milestone indicates that the technology is progressing steadily and remains on track for scheduled mass production in 2025. The 2nm process utilizes new Gate-All-Around (GAA) nanosheet transistors and N2 NanoFlex design, offering significant improvements over the previous 3nm generation, including a 15% performance boost or 24-35% power reduction at the same voltage. TSMC plans to expand 2nm production to both Baoshan and Kaohsiung facilities. Chairman C. C. Wei noted that customer demand for 2nm chips is surpassing that of 3nm, driven by high-performance computing and chiplet designs, without affecting adoption rates. Additionally, TSMC introduced the N2P extension for smartphones and HPC, with mass production set for the second half of 2026. Market analysts suggest that NVIDIA's AI-driven growth could potentially make it TSMC's largest customer by late 2025, overtaking Apple. This development underscores TSMC's continued leadership in semiconductor innovation and its strategic capacity expansion to meet rising global demand for next-generation chips.
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