SK Hynix to Produce HBM4 Chips Using TSMC’s 3nm Process
South Korean memory chip manufacturer SK Hynix has announced plans to produce sixth-generation high-bandwidth memory (HBM4) chips utilizing TSMC’s advanced 3nm manufacturing process. According to reports from The Korea Economic Daily, the company aims to release a prototype of these vertically stacked HBM4 chips, featuring a base die made with the 3nm process, as early as March 2025. Mass production for key clients is scheduled to commence in the second half of 2025, with NVIDIA identified as the primary customer for these shipments. The strategic shift to a 3nm base die is expected to significantly enhance performance, offering a 20-30% improvement over HBM4 chips built on a 5nm base die. This collaboration highlights the growing integration of advanced logic processes into memory chip architecture to meet the escalating demands of artificial intelligence and high-performance computing applications. The move underscores the competitive dynamics in the semiconductor industry, where leading firms are leveraging cutting-edge node technologies to gain performance advantages.
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SK Hynix to Produce HBM4 Chips Using TSMC’s 3nm Process
South Korean memory chip manufacturer SK Hynix has announced plans to produce sixth-generation high-bandwidth memory (HBM4) chips utilizing TSMC’s advanced 3nm manufacturing process. According to reports from The Korea Economic Daily, the company aims to release a prototype of these vertically stacked HBM4 chips, featuring a base die made with the 3nm process, as early as March 2025. Mass production for key clients is scheduled to commence in the second half of 2025, with NVIDIA identified as the primary customer for these shipments. The strategic shift to a 3nm base die is expected to significantly enhance performance, offering a 20-30% improvement over HBM4 chips built on a 5nm base die. This collaboration highlights the growing integration of advanced logic processes into memory chip architecture to meet the escalating demands of artificial intelligence and high-performance computing applications. The move underscores the competitive dynamics in the semiconductor industry, where leading firms are leveraging cutting-edge node technologies to gain performance advantages.
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