Huawei Announces Tau Scaling Law and LogicFolding Chip Technology to Bypass US Sanctions
At the 2026 IEEE International Symposium on Circuits and Systems in Shanghai, Huawei unveiled the Tau Scaling Law (Her’s Law) and LogicFolding architecture, a chip-stacking technique to improve transistor density and energy efficiency without advanced lithography tools. The company plans to launch Kirin chips in the Mate 90 series this autumn, aiming for 1.4nm-equivalent performance by 2031. This move intensifies competition with Apple and Nvidia, and underscores China’s push for semiconductor self-sufficiency amid ongoing US export restrictions.
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Huawei claims chip breakthrough with LogicFolding, aims to close gap with TSMC by 2031
Huawei Technologies Co. announced a breakthrough in semiconductor manufacturing, claiming it will produce 1.4-nanometer chips by 2031 using its proprietary 'LogicFolding' technology, bypassing the need for ASML's extreme ultraviolet lithography machines. Huawei's semiconductor chief He Tingbo revealed the plan at a chip conference, stating that the company's new 'Tau Scaling Law' (dubbed 'Her's Law') focuses on boosting data transmission speed rather than solely shrinking transistors. The first Kirin mobile chips using LogicFolding will launch this fall. The announcement, which defies industry consensus that EUV machines are essential for sub-5nm chips, sent Chinese chip stocks surging, with SMIC rising over 18%. Huawei claims it has designed 381 chips based on the new principle over the past six years, positioning itself to rival TSMC's timeline for 1.4nm mass production in 2028.
Fortune | FORTUNEUS Blocks China from AI Chips; Huawei Claims Workaround to Compete by 2031
The United States continues to restrict China's access to advanced AI chips and semiconductor manufacturing equipment from companies like Nvidia. However, Chinese tech giant Huawei claims it has developed a workaround to build advanced chips comparable to world-leading products by 2031. Speaking at an event in Shanghai, Huawei outlined a new chip design approach called the 'Tau Scaling Law,' which involves stacking multiple circuit layers within a single chip and reducing data travel time. The company says this method could eventually achieve transistor density levels comparable to 1.4-nanometer chips, despite lacking access to ASML's advanced lithography machines due to US export controls. Huawei also revealed its next-generation Kirin smartphone processors, expected later this year, will use a 'LogicFolding' architecture to improve performance. The company is applying the same approach to AI chips but did not provide independent benchmarks. The announcement follows years of tightening US restrictions on Huawei and China's semiconductor industry, pushing Beijing toward technological self-sufficiency.
India Today | Latest StoriesHuawei announces new chip manufacturing method to bypass US sanctions
Huawei's semiconductor division head He Tingbo announced a new chip manufacturing process that allows the company to produce 1.4 nanometer chips by 2031, catching up to TSMC's planned 2028 timeline. The technique reportedly eliminates the need for extreme ultraviolet (EUV) lithography machines, which are subject to US export restrictions. Instead of optimizing space, the new method optimizes communication time between chip elements. He Tingbo stated the solution is feasible, affordable, and offers comparable performance. The announcement underscores the ongoing US-China tech rivalry, with Huawei under American sanctions since 2019 over national security concerns, which Huawei denies. The development suggests Huawei is finding ways to circumvent US technology blockades in advanced semiconductor manufacturing critical for AI systems.
Le SoirHuawei Unveils Major Chip Design Breakthrough as China Pushes Past US Sanctions
Chinese technology giant Huawei Technologies announced a major semiconductor design breakthrough at a symposium in Shanghai, claiming it aims to produce chips with transistor density equivalent to advanced 1.4 nanometer processes. This development could significantly reshape the global technology race and weaken the long-term impact of U.S. sanctions on China's chip industry. The announcement signals China's continued efforts to achieve self-sufficiency in advanced semiconductor manufacturing despite export controls and restrictions imposed by the United States.
Modern DiplomacyHuawei announces new chipmaking technology to bypass U.S. sanctions
Chinese tech giant Huawei announced on May 25, 2026, that it has developed a novel chipmaking approach called the 'Tau Scaling Law' (or 'Her's Law') to circumvent U.S. sanctions that have blocked its access to advanced lithography equipment. He Tingbo, head of Huawei's semiconductor division, stated at the International Symposium on Circuits and Systems in Shanghai that the company aims to produce 1.4-nanometre chips by 2031, compared to TSMC's projected 2028 timeline. The new method shifts focus from transistor density (Moore's Law) to optimizing communication time between chip components. Huawei's upcoming Kirin chip, launching in autumn 2026, will be the first to use the 'LogicFolding' architecture based on this principle. Analysts say the announcement signals Huawei's ambition to lead the global chip race and may heighten U.S. concerns.
The Hindu: Latest News today from India and the World, Breaking news, Top Headlines and Trending News Videos.Huawei unveils new smartphone chips this fall as rivalry with Nvidia and Apple heats up
Chinese telecom giant Huawei announced a new chip design approach called 'LogicFolding' to be used in its Kirin smartphone chips this fall, despite ongoing U.S. sanctions. The breakthrough intensifies competition with Nvidia, which has conceded the Chinese market to Huawei due to export restrictions, and Apple, which faces renewed rivalry in China. Huawei claims the technology could deliver capabilities equivalent to 1.4-nanometer process technology by 2031, but analysts are skeptical, noting that stacked designs do not solve full manufacturing challenges like heat management and yield. Huawei also introduced a new semiconductor scaling principle called the 'Law of Tau' (τ scaling), positioning it as a successor to Moore's Law. The announcement underscores Beijing's push for homegrown technology and is likely to heighten concerns in Washington.
US Top News and AnalysisHuawei Proposes New Chip Development Path Under US Sanctions
Huawei Technologies has announced a new semiconductor development strategy called the Tau Scaling Law, aiming to design high-end chips with transistor density equivalent to 1.4-nanometre processes by 2031, despite US sanctions restricting access to advanced lithography tools. The company introduced the concept at the 2026 IEEE International Symposium on Circuits and Systems in Shanghai. The Tau Scaling Law focuses on reducing signal and data transit times within chips and computing systems, offering an alternative to traditional transistor miniaturization. Huawei's upcoming Kirin chips, launching in fall 2026, will be the first to use a related architecture called LogicFolding, which shortens internal wiring to improve performance. The company also plans to release Atlas 950 and Atlas 960 supernodes, described as the world's most powerful, supporting 8,192 and 15,488 Ascend chips respectively. Huawei claims to have designed and mass-produced 381 chips over the past six years based on this new principle, for use in smartphones and AI computing.
The Indian ExpressHuawei to Launch Mate 90 Series with New Kirin Chip Using Logic Folding Technology This Autumn
At the 2026 International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai, Huawei board member and semiconductor head He Tingbo announced that the company will launch a new Kirin smartphone chip this autumn, featuring logic folding technology for the first time. This technology stacks logic structures into a dual-layer design, improving transistor density and energy efficiency beyond conventional single-layer chips. The chip is expected to debut in Huawei's Mate 90 series in September, competing with Apple's iPhone 18 series. He Tingbo also presented the Tau (τ) Scaling Law, referred to as 'Her's Law,' which could be applied to smartphones and AI computing. Huawei projects that by 2031, high-end chips designed under this law will achieve transistor density equivalent to 14 Å (1.4 nm) processes.
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