Diamond-Copper Coating Boosts Chinese AI Data Centre Cooling Efficiency by 80%
Chinese researchers from the Ningbo Institute of Industrial Technology, part of the Chinese Academy of Sciences (CAS), have developed a novel diamond-copper composite material designed to address overheating issues in artificial intelligence data centres. This innovation reportedly improves cooling efficiency by up to 80 per cent, helping the industry overcome the so-called thermal wall caused by high power density in next-generation chips. The material boasts a thermal conductivity exceeding 1,000 watts per metre-kelvin and has already been deployed in an AI computing node in Zhengzhou, Henan province. Additionally, the composite enhances chip performance by approximately 10 per cent. This development is strategically significant for China, which currently relies on imported high-end heat dissipation materials. By securing an independent supply chain for thermal management solutions, China aims to strengthen its self-sufficient computing infrastructure and core competitiveness in the global AI sector. The breakthrough highlights ongoing efforts to mitigate the physical limitations of hardware scaling in high-performance computing environments.
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Diamond-Copper Coating Boosts Chinese AI Data Centre Cooling Efficiency by 80%
Chinese researchers from the Ningbo Institute of Industrial Technology, part of the Chinese Academy of Sciences (CAS), have developed a novel diamond-copper composite material designed to address overheating issues in artificial intelligence data centres. This innovation reportedly improves cooling efficiency by up to 80 per cent, helping the industry overcome the so-called thermal wall caused by high power density in next-generation chips. The material boasts a thermal conductivity exceeding 1,000 watts per metre-kelvin and has already been deployed in an AI computing node in Zhengzhou, Henan province. Additionally, the composite enhances chip performance by approximately 10 per cent. This development is strategically significant for China, which currently relies on imported high-end heat dissipation materials. By securing an independent supply chain for thermal management solutions, China aims to strengthen its self-sufficient computing infrastructure and core competitiveness in the global AI sector. The breakthrough highlights ongoing efforts to mitigate the physical limitations of hardware scaling in high-performance computing environments.
News - South China Morning Post